Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : FSII - The Worst is Over? -- Ignore unavailable to you. Want to Upgrade?

To: SemiBull who wrote (2722)	6/3/2002 7:06:07 PM
From: SemiBull	Read Replies (1) \| Respond to of 2754

FSI Joins SiLKnet Alliance to Develop and Provide Cleaning Processes and Equipment for Low-k Films MINNEAPOLIS--(BUSINESS WIRE)--June 3, 2002--FSI International, Inc. (Nasdaq:FSII - News) today announced that its Surface Conditioning Division (SCD) has joined The Dow Chemical Company sponsored SiLKnet Alliance(SM) data network to participate in the advancement of low-k surface conditioning solutions, for use in processing SiLK(a) semiconductor dielectric resins. Membership in the Alliance will provide FSI with the opportunity to integrate its low-k cleaning capabilities into an end-to-end low-k solution. Collaboration among the SiLKnet Alliance members enables the development of proven, production-ready low-k products and processes that support the integration of SiLK in the 130-nm technology node and beyond. "Alliances that offer end-to-end solutions for the seamless implementation of technology are integral in helping chipmakers stay on pace with the International Technology Roadmap for Semiconductors (ITRS). With the addition of FSI, the SiLKnet Alliance gains an established cleaning company. FSI brings nearly 30 years of experience and expertise in batch spray, and its proprietary CryoKinetic technology will expand the capabilities of the Alliance," said Greg Bauer, development director for the SiLKnet Alliance. Low-k and ultra low-k technology development is critical to advancement within the IC industry. The ITRS calls for the implementation of ultra low-k for production by 2005, which means that it must be in R&D by 2002. Involvement with the Alliance will allow FSI to play a key role in developing leading-edge low-k and ultra low-k technology through the enhancement of its BEOL cleaning solutions. "Low-k integration is challenging, but the end-to-end solutions developed through the SiLKnet Alliance will ultimately facilitate the ease and increase the speed of implementation, while lowering the risks. Through FSI's shared development efforts within the Alliance, the company will be better positioned to compete in the back-end-of-line cleaning market," commented Jeff Butterbaugh, FSI's Surface Conditioning Division chief technologist. FSI will use its ZETA® 300 BE Surface Conditioning Systems and ANTARES® CX Advanced Cleaning Systems for the development work, as well as its lab facilities in Chaska, Minnesota for development and demonstration purposes. The development will focus on using the ZETA Systems for post-ash clean and resist strip, and using the ANTARES Systems for pre-deposition particle removal. FSI's low-k clean capabilities have already been demonstrated in its process lab and at several customer sites. FSI International Inc., a global supplier of wafer cleaning and resist processing equipment and technology, delivers economic and technical advantages for current and emerging microelectronics manufacturing challenges. Using the company's broad portfolio of products, which include immersion, spray, vapor and CryoKinetic systems for wafer cleaning, and resist processing systems for wafer coating and developing, customers are able to efficiently achieve their goals. FSI's customers include microelectronics manufacturers located throughout North America, Europe, Japan and the Asia-Pacific region. FSI maintains a web site at: www.fsi-.intl.com. The SiLKnet Alliance is the semiconductor industry's first and broadest technical collaboration on low-k materials integration. Since its formation in 2001, the SiLKnet Alliance has seen membership grow to more than 20 semiconductor industry suppliers. These member companies are developing fab-ready materials, equipment and processes that complement SiLK resins and ENSEMBLE(a) dielectric solutions in every key back-end-of-line (BEOL) manufacturing step - including the clean, CMP, etch, spin-on track, metrology, ashing and test, assembly and packaging process modules. Membership is by invitation only, but non-exclusive to promote a variety of products and processes compatible with SiLK integrated stack resins from The Dow Chemical Company. More information about SiLKnet is available at the Alliance's Web site (www.silknetalliance.com). (SM) Service mark of The Dow Chemical Company (a) Trademark of The Dow Chemical Company -------------------------------------------------------------------------------- Contact: FSI International, Inc., Minneapolis Trade Media: Laurie Walker, 952/448-8066 or Financial Media and Investors: Benno Sand, 952/448-8936