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To: Haim R. Branisteanu who wrote (171371)6/9/2002 12:03:49 PM
From: maceng2  Respond to of 436258
 
Die size reduction is only performed when it's known that "die per wafer" yield is increased. It's a very expensive process change. If the yield is less then 100%. Teams of engineers work on the problems until the die yield is at least above 90%.

As an engineer in 1980's I once worked on a specific problem where the die yield was only 10% or less. Most of the autos in the USA were on production hold because of this problem. The solution wasn't what the bosses wanted to hear btw. I still laugh at those times.