From RB:
DD Summary Update: June 25, 2002
What was updated:
June 24, 2002
- NanoPierce Subsidiary ExypnoTech to Supply Schreiner LogiData With Smart Inlays
Raging Bull / Lycos is censuring links. Many links for further DD have been removed to post this current summary on Raging Bull / Lycos. Full DD appears on other forums.
Website:
nanopierce.com
Contact information:
NanoPierce Technologies, Inc.
370 17th Street, Suite 3580
Denver, Colorado, USA 80202
303-592-1010
303-592-1054 (FAX)
Paul Metzinger
President & CEO
Denver, Colorado Office
paul@nanopierce.com
Sarah Roth
Assistant to Paul H. Metzinger
sarah.roth@nanopierce.com
Dr. Michael E. Wernle
President & CEO of
NanoPierce Card Technologies GmbH.
Based in Munich, Germany
(011)49-8102-999-372
michael@nanopierce.com
Dr. Herbert J. Neuhaus
President and CEO of
NanoPierce Connection Systems, Inc.
Colorado Springs, Colorado
herb@nanopierce.com
4180 Central Park Dr.
Colorado Springs, Colorado, 80916
719-638-5930
Kristi J. Kampmann
Chief Financial Officer
Director of Investor Relations
Denver, Colorado Office
kristi@nanopierce.com
SEC Website:
sec.gov
Photos:
In investor to investor, PHOTOS of NanoPierce Gmbh, NanoPierce Colorado Springs, NCS in IMAPS, and IMAPS articles on NCS, NPCT Open House 10/6/2000, NPCT GmbH Open House 9/20/2001:
The following are found on Investor to Investor:
NanoPierce Gmbh Open House in Munich, Germany
NanoPierce Open House
NanoPierce Gmbh
NanoPierce Colorado Springs
NanoPierce in IMAPS remember to click next page(s)
Photos are also found on NanoPierce's website
nanopierce.com
Call the company to inquire about the contents of this or any post.
This summary is linked to the previous summary and is linked back to December 1999. If you wish to see the previous chain of summaries, click on the "Reply To" post number.
Share Statistics:
Authorized: 200 million
Oustanding: 55.7 million, 65.4 million fully diluted
Float: 35.9 million (rounded)
Exchanges NanoPierce Trades:
OTC:BB NPCT
Frankfurt, Berlin, Hamburg, Xetra: NPI
WKN number: 916132
NCS Technology:
NCS -> NanoPierce Connection System (From NPCT's website)
nanopierce.com
The NCS process is ingenious and yet simple. Basically, microscopic particles of inexpensive, readily available materials such as industrial diamond dust and metal are simultaneously deposited onto a contact surface. This step can be easily performed in a simplified electro-plating-type bath.
Under slight pressure, the hard diamond particles contained in the mixture penetrate the contact beneath the electronic component, thus providing an electrical connection.
NanoPierce has 23 employees and growing focused on exploiting this technology. Web interviews and shareholder newsletters have indicated that NanoPierce is in discussions and testing with global corporations such as IBM, Texas Instruments, Infineon, Motorola, Gemplus, Phillips, Schlumberger, Orga, and others.
An Orientation on NanoPierce's Technology for New Investors: A post by Geoff Krone
English:
ragingbull.lycos.com
German (Translated by Finnegan and JetsiaDax):
ragingbull.lycos.com
An Interview of Dr. Wernle by Finnegan on February 14, 2002:
Posted on February 16, 2002
ragingbull.lycos.com
A Short Update from Finnegan interview of Dr. Wernle on October 4, 2001:
ragingbull.lycos.com
Finnegan's report on the Open House, September 20,2001: compiled by Snuffer
ragingbull.lycos.com
Considering Risk: A post by Zties
ragingbull.lycos.com
United States Patent and Trademark Office: request by Bronze to research NanoPierce's patents
uspto.gov
Pros:
- June 24, 2002 -- NanoPierce Subsidiary ExypnoTech to Supply Schreiner LogiData With Smart Inlays
NanoPierce Technologies, Inc. today announced the signing of a declaration of intent stating that its subsidiary ExypnoTech GmbH of Rudolstadt, Germany, will supply smart labels to Schreiner LogiData GmbH & Co KG, a subsidiary of Schreiner GmbH & Co. KG of Munich, Germany.
Schreiner and NanoPierce Card Technologies GmbH have been collaborating since November 2000 to evaluate and test NanoPierce's NCS(TM) (NanoPierce Connection System) technology for the production of smart labels. Building on the successful results of these developments, Schreiner LogiData GmbH & Co. KG will begin using smart inlays from ExypnoTech GmbH in the autumn of 2002.
- May 23, 2002 – NanoPierce Executive to Receive Prestigious Recognition by Premier Industry Group
NanoPierce announced today that Dr. Herbert J. Neuhaus will receive the prestigious distinction of Fellow of the Society of IMAPS, the International Microelectronics Packaging Society.
This award represents peer recognition of Dr. Neuhaus' significant and continuing contributions to both IMAPS and the microelectronics industry.
- April 11, 2002 -- Veteran Electronics Technologies Expert John T. Hoback Joins NanoPierce Board of Directors
As a Director, John T. Hoback brings extensive experience in building electronic materials businesses from a zero base to multi-million dollars in revenues. He has an enviable record of starting businesses from ideas or concepts, guiding them through commercialization and then participating in the demanding management environment of growing those businesses to revenue levels approaching $100 million. His success has been due to accelerating the time to market of numerous new products, coupled with both company/technology acquisitions, and establishing strategic partnerships that were aimed at achieving long-term competitive position.
- April 9, 2002 -- NanoPierce Technologies Inc. Closes $2,000,000 Financing
The Financing provides the Company with an initial $1,000,000 infusion consisting of 800,000 Units purchased at $1.25 per Unit. Each Unit consists of 1 share of Common Stock and 1.1 Warrants exercisable at $1.45 to purchase one share of common stock. If all Warrants of the first stage are exercised, an additional $1,439,850 will be paid to the Company. The Warrants must be exercised for cash for as long as the Company maintains the effectiveness of its S-3 Registration Statement. A second capital infusion of $1,000,000, if accessed by the Company, would be similarly structured but based on the market price of the common stock of the Company on the date the second stage is priced. The second stage financing is available to the Company, subject to pricing, as early as thirty days following the closing of the first stage.
The financing was arranged by Bathgate McColley Capital Group, LLC., of Denver, Colorado, and provided by Generation Capital Associates, Atlanta, Georgia.
- April 3, 2002 – NanoPierce Connection Systems Inc., a subsidiary of NanoPierce Technologies, Inc., announced the filing, on behalf of NanoPierce Technologies, Inc., of a new patent application protecting a recent invention related to ultrasonic flip chip bonding of semiconductor chips and ultrasonic bonding of other electronic components treated with NCS(TM) (NanoPierce Connection System). Among the many advantages provided by this new bonding technology are greater thermal reliability and a significantly faster assembly process. This key development opens the way for the introduction of NCS(TM) to relatively demanding markets such as automotive electronics and many others.
- March 25, 2002 – NanoPierce files 8K disclosing the increase of the Authorized from 100 million to 200 million shares. This filing is for among other reasons:
(i) to have sufficient authorized capital available for anticipated strategic investment opportunities; and
(ii) as part of a strategic plan incorporating defensive measures to reduce the likelihood of a hostile takeover.
- March 18, 2002 – Mr. G. William (Bill) Pfeiffer has joined NanoPierce Connection Systems, Inc., as head of Business Development.
Before joining NanoPierce, Mr. Pfeiffer was with 3M Company for 28 years. Most recently, as 3M Corporate Strategic Account Director, Mr. Pfeiffer was key in establishing 3M's Strategic Account program. He coordinated worldwide projects with 3M's global customers across diverse market segments. Through his interactions with customers at U.S., European and Asian locations, he led development of numerous successful partnerships for 3M. By initiating collaborative programs and a series of advanced technology seminars and significantly increasing awareness of 3M technologies and products, Mr. Pfeiffer identified partnering opportunities that led to multi-million dollar contracts for 3M. During Mr. Pfeiffer's tenure at 3M he has also held the titles Program Development Manager, Professional Services Manager, and Senior Research Physicist.
- March 4, 2002 -- NanoPierce's New Subsidiary ExypnoTech Orders First Smart Inlay Production System Incorporating Company's Newly Developed High-Speed Bonding Process.
NanoPierce’s Inc., ExypnoTech GmbH i.G. subsidiary has placed a purchase order for its first production system for smart inlays, which are used in the manufacturing of smart labels. Delivery of the production system is scheduled for late Spring 2002.
The chosen flip-chip die bonding system from F&K Delvotec, Munich,
- March 1, 2002 – Schneider Securities, Inc. hosts a conference in Las Vegas for Brokers and Investors. NanoPierce will be presenting to all in attendance in the morning and in the afternoon, a luncheon presentation exclusive to NanoPierce.
- February 21, 2002 -- Schneider Securities, Inc. initiated coverage on NanoPierce Technologies Inc. with a speculative/Buy rating.
- February 11, 2002 -- NanoPierce Technologies Inc. Founds Smart Inlay Production Company ``ExypnoTech GmbH'' in Germany
ExypnoTech will become the first company in the world using the benefits of the newly developed WaferPierce(TM) flip-chip process developed by another subsidiary of NanoPierce, NanoPierce Connection Systems Inc. (Press Release dated January 15, 2002, ``NanoPierce Technologies To Commence WaferPierce Production''), Colorado Springs, Colorado, for high-volume production of low-cost RFID smart inlays and tags. Following a ramp-up phase for equipment and personnel, high-volume production is expected to start in the second half of this year (Press Release dated January 14, 2002, ``Smart Inlay Production At NanoPierce Card Technologies, GmbH To Be Spearheaded By Bernhard Maier, New Director Of Operations'').
- February 6, 2002 -- NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc., today announced that the German ministry of business and technology is supporting its research into the assembly and bonding of LED (Light Emitting Diode) arrays. The research is being carried out in close co-operation with Elcos AG of Pfaffenhofen, Germany.
The German ministry of business and technology (Bundesministerium fur Wirtschaft und Technologie) through the working group for industrial research (AiF, Arbeitsgemeinschaft industrieller Forschungsvereinigugen "Otto von Guericke" e.V.) will support the ongoing research of NanoPierce Card Technologies GmbH with EUR 100,000.
- January 27, 2002 –- Shareholder letter from CEO Paul Metzinger:
ragingbull.lycos.com
- January 23, 2002 -- NanoPierce Technologies, Inc. today announced that a Research report on the company has been issued by General Research GmbH of Munich, Germany.
The Research Report was authored and published by Dr. Georg Hochwimmer. The 25-page Research Report, originally prepared in German, has been translated into English and will soon be posted on the Company's website. The Report recommends a Long Term Buy Rating for the Company's common stock and projects target market prices.
nanopierce.com
- January 22, 2002 -- NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc., announced today that Mr. Richard Lancaster joins the subsidiary, effective February 1, 2002, as Chief Financial Officer.
- January 15, 2002 -- NanoPierce Technologies, Inc. today announced commencement of WaferPierce(TM) production and a new operational organization.
Dr. Herbert J. Neuhaus has been appointed President and Chief Executive Officer of the newly formed, wholly owned subsidiary NanoPierce Connection Systems, Inc.
NanoPierce Connections Systems, Inc., has been chartered to undertake high-volume-production WaferPierce(TM), a revolutionary and enabling semiconductor wafer treatment for ultra-low-cost flip-chip without the necessity of wire bonding, conductive adhesives, or soldering.
- January 14, 2002 -- NanoPierce Card Technologies GmbH announced the appointment of Bernhard Maier, effective immediately, as Director of Operations to spearhead the development of high-volume smart inlay production for NanoPierce Technologies.
Successful WaferPierce(TM) developments at NanoPierce in Colorado Springs along with favorable smart inlay developments in the Munich laboratory represent both a solid basis and a springboard enabling NanoPierce to launch application-based production activities. Smart inlays will soon become NanoPierce's first high-volume commercial application, to take advantage of the benefits of the revolutionary NanoPierce Connection System NCS(TM) in a market with enormous growth potential.
- January 8, 2002 -- NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc., announced today that Mr. Michael von Mackensen joined the company effective January 1, 2002.
He will be in charge of Sales & Marketing for the introduction of WaferPierce(TM) to key applications, among others, like Smart Card Chip Modules and LEDs. Mr. von Mackensen will report directly to Dr. Michael E. Wernle, CEO & President of NanoPierce Card Technologies GmbH.
- January 2, 2002 -- NanoPierce Card Technologies GmbH, a subsidiary of NanoPierce Technologies, Inc. today announced the signing of a letter of intent (LOI) with the Taiwan-based Opto Tech Corporation, one of the leading suppliers of LED semiconductors worldwide.
"This agreement represents a significant milestone in NanoPierce's sales and marketing plan, as well as our product development process. Our new cooperative partner, Opto Tech, holds an extremely strong position in the field of wafer production for light-emitting diodes (LEDs). In addition to producing and selling LED dies, Opto Tech produces and sells finished optoelectronic products itself," explains Dr. Michael E. Wernle, President and chief Executive Officer of NanoPierce Card Technologies, GmbH.
- December 3, 2001 -- Noel Eberhardt, Prominent Industry Expert, Joins NanoPierce Technologies, Inc. Noel Eberhardt was appointed to its Board of Directors on November 28, 2001.
Noel Eberhardt, formerly Vice President for Advanced Technology of Indala Corporation (Motorola WSSD Worldwide Smart Card Systems Division), San Jose, California, a wholly owned subsidiary of Motorola Incorporated, was the driving force behind the development of Motorola's BiStatix smart label project. Prior to its acquisition by Motorola, Indala Corporation was a successful pioneer and innovator in radio frequency identification technology.
- October 22, 2001 -- The Institute for Machine Tools and Industrial Management of the Technische Universitat Munchen to Present the NanoPierce Connection System During Productronica 2001
- October 8, 2001 -- NANOPIERCE TECHNOLOGIES, INC., announced it will debut its break-through WaferPierce(TM)connection system to the electronics packaging industry at the 2001 International Microelectronics and Packaging Society (IMAPS) Exhibition and Conference in Baltimore, Maryland.
- September 27, 2001 -- Auditors of NanoPierce Technologies, Inc. Remove ``Going Concern'' Qualification on Financial Statements
Consider the ramifications of auditors removing the “Going Concern” qualification on the financial statements. It has been mentioned numerous times that this is more significant than most previous releases.
- September 24, 2001 -- NanoPierce Technologies, Inc. Expands WaferPierce Production Staff
- September 20, 2001 -- NanoPierce GmbH holds open house, which was well attended by corporate representatives, Press, and investors. This investor (Kent) was present and gained a great appreciation for the viability of this company, the global focus for NCS exploitation near term and long term, and the quality of both the personnel and business focus within NanoPierce.
- September 20, 2001 -- NanoPierce Technologies, Inc., and Simotec GmbH Demonstrate First Ever WaferPierce Application on Simotec High Speed Production System
- September 18, 2001 -- NanoPierce Card Technologies GmbH Announces the Opening of New Sales Representative Offices in Taiwan
- August 16, 2001 -- Paul Metzinger interviewed by WallStreet Reporter. WSR called NanoPierce for the interview as a follow up do to the increasing awareness of NanoPierce and NCS within the industry and investment community.
The interview is no longer available on line.
- August 9, 2001 -- NanoPierce Article in SiliconStrategies.
siliconstrategies.com
- August 8, 2001 -- Shareholders of NanoPierce Technologies, Inc., File Colorado Organized Crime Control Act Complaint Against Thomson Kernaghan, Jefferies Group, Inc. and Jefferies & Company, Inc., in Colorado State Court
- July 31, 2001 -- NanoPierce Card Technologies GmbH Announces Production of the First Test Wafers With WaferPierce Contacts
- July 16, 2001 -- NanoPierce Technologies, Inc. Files WaferPierce Patent Application and International Filing for its ``FLIP CHIP'' Patent Application |
