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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: heatsinker2 who wrote (85376)	7/19/2002 11:59:09 AM
From: wanna_bmw	Respond to of 275872

heatsinker, Re: "A great mystery for me is this: Why doesn't Barton include a thermally enhanced package (ie internal heat spreader)? The Tbred is currently packaged with a cheapo Duron-class package. I'm sure AMD could hit higher frequencies with a better package." Packaging requires its own R&D costs. You don't just get better packaging for nothing. Right now, Intel's packaging technology is leading the industry, with BBUL designs set for the 2004 time frame. It looks like Hammer's package is a big improvement for AMD, but they are still catching up in this field. In terms of Barton, though, it should be easier to cool than the Thoroughbred, due to the extra cache, which is likely to spread out heat density. Although power dissipation is likely to be higher than Thoroughbred, the number of watts per mm^2 will likely be smaller, and that's an important consideration when coming up with cooling mechanisms. Hammer will of course be hotter and denser than Barton, so AMD needs the better packaging for that part. wbmw