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Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (1690)	7/22/2002 11:04:21 AM
From: Proud_Infidel	Respond to of 25522

Applied Materials Announces Revolutionary Fixed-Abrasive CMP Solution New Slurryless Process for the Reflexion Fixed-Abrasive Web System Enables Sub-100nm Direct Polish STI Applications SANTA CLARA, Calif.--(BUSINESS WIRE)--July 22, 2002-- Applied Materials, Inc. today introduced its revolutionary new Reflexion Fixed-Abrasive Web(TM) CMP (chemical mechanical planarization) system with a unique slurryless process for forming the STI (shallow trench isolation) structures in sub-100nm devices. The system sets a new benchmark for STI planarization by virtually eliminating "dishing" and "erosion" effects that can limit device performance and yield. Instead of using a polishing pad and slurry to planarize the wafer, Applied Materials' Reflexion Fixed-Abrasive Web technology employs a roll of fabric-like material that contains the polishing abrasive. Integrating the abrasive into the fabric effectively eliminates dishing, or the removal of material from low areas on the wafer caused by "free" abrasive particles. Erosion is resolved by using nitride selective chemistry that curtails polishing once nitride is exposed. "Shallow trench isolation CMP is a critical step in transistor fabrication and represents one of the most difficult challenges facing chipmakers," said Russell Ellwanger, vice president and general manager of Applied Materials' CMP and ECP Product Business Group. "Our fixed abrasive polishing technology addresses this hurdle, enabling customers to fabricate STI structures to the 65nm device generation by supporting superior planarity and defect performance. With our unique 'web magazine' approach, every wafer sees the same polishing conditions for exceptional repeatability of on-wafer results." Applied Materials' Reflexion Fixed-Abrasive Web CMP process is a production-qualified solution tailored specifically for sub-100nm direct polish STI applications. This process leverages the flexibility of the production-proven Reflexion(TM) architecture, which can be configured to support sequential, multi-step web processes using a variety of materials and chemistries for customized polishing results. The Reflexion Fixed-Abrasive Web system features one to two abrasive web magazines mounted in place of conventional platens. During polishing, the abrasive material is stationary on the magazine that rotates while the polishing head both turns and sweeps across the surface. After each wafer is processed, the abrasive material is advanced, consistently replenishing the abrasive before the next wafer is polished to provide uniform and repeatable polishing conditions for every wafer. Using fixed-abrasive web technology eliminates variability caused by pad conditioning, slurry and pad life, providing higher repeatable, "steady-state" results. The web magazines can be retrofitted to existing Reflexion STI systems, extending their capability to sub-100nm geometries and beyond. Based on the many advantage of its fixed-abrasive web technology, Applied Materials has multiple Reflexion Fixed-Abrasive Web systems qualified and in production at leading semiconductor fabs in the U.S., Europe and Asia. Applied Materials, (Nasdaq: AMAT - News) the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' web site is www.appliedmaterials.com. Note: A Photo is available at URL: businesswire.com