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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Dan3 who wrote (168886)	7/31/2002 10:29:38 AM
From: Yousef	Read Replies (1) \| Respond to of 186894

Dan3, Re: "Also note that the surface of a sealed box will be at the same temperature as its contents ..." Really !! ... There should be some interesting follow-on discussion to this "technical pronouncement". <ggg> I'm just going to sit back and watch this one !! Make It So, Yousef

To: Dan3 who wrote (168886)	7/31/2002 12:28:02 PM
From: ted burton	Read Replies (1) \| Respond to of 186894

Re:If anyone has a better thermal solution, it's AMD, but the trade-off is that an inexperienced installer is a little more likely to damage the chip. Note that AMD used a case on the old K6-2, but elected to go with a bare die for Athlon to improve thermal conduction. Also note that the surface of a sealed box will be at the same temperature as its contents, e.g. the temperature of a die, and the wrapping of a tightly wrapped die, will be the same. It's called the law of conservation of energy.... ------------------------------------------------------------ What fun - a mental midget with attitude! I poke fun at one idiotic statement, & he makes two or three more. As an added bonus, this time he gives us two nutzo statements going to opposite extremes: 1. Athlon went to bare die to improve thermal conduction - making it better than Intel's. 2. The surface of a "sealed box" (Intel's soln.) will be at the same temperature as its contents (a 50W heater). This statement implies a thermal resistance of exactly zero degrees per watt for the "sealed box". In other words, "sealed box" is a perfect zero resistance thermal solution, but a bare die is even better - dude, that is so cool! For the Mental Midget Club (MMC), this is sarcasm. By the way, Dan, you're now 180 degrees from your original reasoning on why Intel was bad and AMD was good. I think it's always been clear the real reason is that you own AMD stock, but not Intel stock. -Ted P.S. I obviously don't speak for Intel.

To: Dan3 who wrote (168886)	7/31/2002 12:30:30 PM
From: tcmay	Read Replies (1) \| Respond to of 186894

"Also note that the surface of a sealed box will be at the same temperature as its contents, e.g. the temperature of a die, and the wrapping of a tightly wrapped die, will be the same. It's called the law of conservation of energy.... " No, this is not so. In a steady-state situation with a heat source (power source) somewhere inside a system (box, case, etc), the temperature at the source will be higher than the temperature further out. This is implied by the usual heat flow equations. For example, consider a heat-producing chip glued to the wall of a large house, the house acting as the case. Do you think the temperature of the roof of the house, or the walls, or the basement floor, is "at the same temperature as it contents"? Granted, a chip case is much smaller than a house. But the same logic applies. Heat flow equations determine the case temperature, not simplistic reasoning that the law of conservation of energy requires the temperatures to be the same...which it doesn't. --Tim May

To: Dan3 who wrote (168886)	7/31/2002 12:36:34 PM
From: greg s	Read Replies (1) \| Respond to of 186894

re: Also note that the surface of a sealed box will be at the same temperature as its contents, e.g. the temperature of a die, and the wrapping of a tightly wrapped die, will be the same. It's called the law of conservation of energy.... Danny, sometimes it is better to keep your mouth shut and risk being taken for a complete idiot than to open it and remove all doubt.