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Technology Stocks : Lam Research (LRCX, NASDAQ): To the Insiders -- Ignore unavailable to you. Want to Upgrade?

To: Kirk © who wrote (4839)	9/3/2002 11:41:56 AM
From: Proud_Infidel	Respond to of 5867

I sold what little SFAM I had at about 4.40 and rotated into ASML....not much though:-(

To: Kirk © who wrote (4839)	9/10/2002 10:32:22 AM
From: Proud_Infidel	Read Replies (1) \| Respond to of 5867

AMD Selects Lam's 2300 Etch Series for Next-generation Logic and Flash The 2300(TM) Exelan(R) Dielectric and 2300 Versys(TM) Silicon Etch Systems Will be Employed for Both Front- and Back-end AMD Etch Applications Tuesday September 10, 10:30 am ET FREMONT, Calif.--(BUSINESS WIRE)--Sept. 10, 2002-- Lam Research Corporation (Nasdaq:LRCX - News) today announced that Advanced Micro Devices, Inc. (NYSE:AMD - News), Sunnyvale, Calif., has selected Lam's 2300 Etch Series to develop next-generation logic and flash processes. The 2300 Exelan dielectric and 2300 Versys silicon etch systems will be employed for both front- and back-end etch applications for AMD's development efforts. The 2300 Etch Series was selected for its straightforward 200/300-mm scaling and superior etch technology. The equipment is installed at AMD's Submicron Development Center (SDC), which supplies next-generation technology to all AMD Fabs worldwide. "The transition to 300-mm technology helps us offer even greater benefit to our customers," said Dr. Linton Salmon, director of Advanced Process Development for AMD. "During the transition, we need to move easily between 200- and 300-mm wafer sizes. We expect that the 2300 Etch Series equipment will enable developing 200-mm processes cost effectively followed by straightforward scaling to 300 mm." "Being selected for AMD's next-generation etch processes validates the 2300 Etch Series' process versatility and advanced capability," said Ferdinand Seemann, Lam's vice president of North America Field Operations. Examples of applications in development for both logic and flash at AMD include high-aspect-ratio contact (HARC) and low k etch. AMD will also be developing in situ processing for dual damascene to implement maximum cost reduction in the back-end. This press release contains certain forward-looking statements that are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such forward-looking statements include those relating to AMD's future uses for Lam equipment, the ability to scale processes to larger wafer sizes, process developments, cost effectiveness and potential process applications, among others. Such statements are based on current expectations and are subject to risks, uncertainties, and changes in condition, significance, value and effect including those risks detailed in documents filed with the Securities and Exchange Commission, and specifically the report on Form 10-K for the fiscal year ended June 30, 2002, which could cause actual results to vary from expectations. The company undertakes no obligation to update the information in this Press Release. Lam Research Corporation is a leading supplier of wafer fabrication equipment and services to the world's semiconductor industry. Lam's common stock trades on the Nasdaq National Market under the symbol LRCX. The Company's World Wide Web address is lamrc.com.

To: Kirk © who wrote (4839)	9/25/2002 3:32:32 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 5867

Lam Breaks New Ground to Advance Silicon Etch for Sub-90 nm Processes New 2300 Versys Star(TM) introduces unique technologies for step-by-step control of temperature and gas flow to meet next-generation CD uniformity requirements Wednesday September 25, 3:23 pm ET FREMONT, Calif.--(BUSINESS WIRE)--Sept. 25, 2002-- Lam Research Corporation (Nasdaq:LRCX - News) today launched the 2300 Versys Star silicon etch system for 200 and 300 mm applications. Building on the success of Lam's market-leading 2300 Versys, the 2300 Versys Star expands process capability for etching the complex structures required for sub-90 nm applications. The new system introduces unique technologies for rapidly controlling temperature and gas flow step-by-step across the wafer surface to meet next-generation CD uniformity requirements. For a typical gate etch process, applying these new tuning capabilities of the 2300 Versys Star reduces CD variation by as much as 50%. "This latest achievement demonstrates Lam's continued technology leadership and differentiation to solidify our position as number one in market share for silicon etch. No other silicon etch system in the industry offers this level of process control and wide process window to address next-generation process challenges. The 2300 Versys Star is in production at major foundries and has also shipped to logic and memory fabs in key regions around the world," stated Nick Bright, Lam's vice president and general manager of global products. The 2300 Versys Star enables in situ etching of complex film stacks, such as resist trim followed by antireflective coating (ARC) and hardmask open over dual-doped polysilicon gate as well as shallow trench isolation (STI) etch. The system's new capabilities to rapidly tune wafer temperature and gas flow offer flexibility and step-by-step uniformity control to optimize each layer of the complex stack, delivering enhanced performance and productivity. This press release contains certain forward-looking statements which are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to next-generation process requirements and results, market share estimates and machine performance, among others. Such statements are based on current expectations and are subject to risks, uncertainties and changes in condition, significance, value and effect as well as other risks detailed in documents filed with the Securities and Exchange Commission, including specifically the report on Form 10-K for the year ended June 30, 2002, which could cause actual results to vary from expectations. The company undertakes no obligation to update the information or statements made in this press release. Lam Research Corporation is a leading supplier of wafer fabrication equipment and services to the world's semiconductor industry. Lam's common stock trades on the Nasdaq National Market under the symbol LRCX. The Company's World Wide Web address is lamrc.com. Note: A Photo is available at URL: businesswire.com