To: Sarmad Y. Hermiz who wrote (65926 ) 9/16/2002 7:59:22 PM From: SemiBull Read Replies (1) | Respond to of 70976 Bringing us back to the point of this thread.... Applied enters standalone RTP equipment market By Mark Lapedus, Semiconductor Business News Sep 16, 2002 (4:32 AM) URL: siliconstrategies.com SANTA CLARA, Calif. -- Taking a new approach in a critical chip-production market, Applied Materials Inc. here today entered the standalone rapid thermal processing (RTP) equipment arena, by rolling out a new tool for 300-mm wafer fabs. The Radiance Vantage is a dedicated, two-chamber RTP tool for use in developing advanced transistors in 130-, 90-, and 65-nm chip designs, said Ben Bierman, managing director of the thermal systems and modules division in Applied's transistor and capacitor group. The Vantage tool supports the critical annealing, oxidation and related steps in high-volume, 300-mm chip production, Bierman said. "I expect [the Vantage] will be our workhorse RTP system until 2006," he said in an interview with SBN. With the Vantage tool, Applied hopes to extend its lead in RTP. It claims to be the leader in this arena, with 84% market share in 2001. In total, RTP was a $367 million equipment market last year, according to Santa Clara-based Applied. While Applied is the king of the hill in RTP, the Santa Clara-based equipment giant is taking a new approach in this market. It is offering a dedicated, standalone RTP platform, an approach that has already been endorsed by several vendors in the marketplace, it was noted. Until now, Applied offered an RTP chamber within its Centura line of fab tools. The Centura is a 200/300-mm, multi-chamber system that supports chemical vapor deposition, RTP and other technologies for production fabs. Essentially, Applied took the so-called Radiance RTP chamber from the Centura and bolted it to a new, dedicated mainframe, dubbed the Vantage. Applied will continue to offer the RPT chamber in the Centura, but noted that the dedicated Vantage tool has several advantages over the cluster-tool approach in IC production. The Vantage has 45% fewer components than the Centura, which lowers overall system costs and boosts the reliability for RTP, Bierman said. "The Vantage is half the size of the Centura," he said. "It also has a 5%-to-10% greater throughput than the Centura," he said. Bierman denied that Applied is moving away from its previously- announced initiative to push modular or cluster tools as the mainstay technology for IC production environments. "Clustering has some advantages. There are some advantages for gate stacking applications," he said. "But for most annealing steps, our customers would choose a dedicated tool for production." The Radiance Vantage supports all annealing applications in 300-mm production fabs, such as implant annealing, spike annealing and salicidation. It also supports dry rapid thermal oxidation. Target salicidation markets include the deposition of cobalt, nickel and titanium. RTP supports all annealing applications, he said. RTP is also replacing furnaces for many oxidation applications. The tool supports a temperature process range from 300 degrees Celcius to 1200 degrees Celsius. The tool has a ramp-up temperate rate of 250 degrees Celsius per second and a cool down rate of 90 degrees Celsius per second. The tool is configured with up to two RTP process chambers, which are linked to a factory interface and track robot. A simplified wafer transfer sequencing system enables the tool to have an overall throughput of more than 100 wafers per hour. Applied has begun shipping the tool to undisclosed customers for DRAM, logic, and other chip applications.