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To: Yousef who wrote (88351)9/20/2002 2:17:59 PM
From: PetzRespond to of 275872
 
Some thoughts on "back end verification of SOI technology"

Perhaps -
1. Hot spots - this is something not discovered until packaging but might require the design change mentioned to fix it or possibly use of Si28. Also, the die would be fully functional, just not able to run at full speed without heroic cooling technology.
2. Migration problems or some other problem affecting long-term reliability.

(2) would be worrisome, (1) not so bad

Also, hot spots might be less of a problem with Sledgehammer with its larger die.

Petz