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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: COMMON_SENSE who wrote (171434)	10/2/2002 9:27:16 PM
From: Robert Salasidis	Read Replies (2) \| Respond to of 186894

Looking at the financial statements biz.yahoo.com Between paying the current portion of LTD, and the short term, added to about 300-350M/quarter loss, they have about 7 months of cash remaining Hammer will not be at volume by that time. What this means is that they will need a successful product (even if in low volume) - that they can leverage to issue new debt (or more likely new shares - increasing dilution) If there is much delay past 6-7 months in the introduction of Hammer, or if the intro is less than spectacular - then they are toast. It will be interesting to see if Intel goes for the jugular at this time.

To: COMMON_SENSE who wrote (171434)	10/3/2002 10:47:27 AM
From: Yousef	Read Replies (1) \| Respond to of 186894

CommonSense, Re: "AMD will lose $350 milion for Q3 ... and I think they are fried now ... The stockholders are zipped and the stock will now drive down to $1 where it really belongs ... They are cooked!" Now that was "uplifting" !! ... Here's why all of that will come true --> Hector Ruiz as head of the Motorolo Semiconductor Products Group was "hell bent" on outsourcing Motorolo's Fab capacity. When internal politics stalled his plans, he sold Jerry Sanders (the turd) on how AMD could dramatically reduce costs (Fab and development) by partnering with silicon foundries (TSMC, UMC ...). Jerry "bit" and took "hook, line, and sinker". Jerry made Hector CEO of AMD and headed down this very risky path. AMD then made their next mistake ... They chose the lower wafer price silicon vendor (UMC) as their "partner". the AMD/UMC partnership was supposed to start on future technology (65nm), but quickly got pushed back to 130nm technology to try and drive AMD's costs down. UMC/AMD couldn't deliver because of their decision to use LowK at 130nm. This process (LowK) has much lower yield and poorer reliability than the process being replaced (FSG/TEOS). AMD was forced to incorporate this "new material" to try and stay up with INTC in process performance. You see ... It really has been about the "process thingy" all along!! Make It So, Yousef