To: Steve Lee who wrote (3540 ) 10/9/2002 2:16:22 PM From: Proud_Infidel Read Replies (1) | Respond to of 25522 Wacker builds 300-mm silicon wafer plant after delays Semiconductor Business News (10/09/02 01:40 p.m. EST) BURGHAUSEN, Germany--After a series of false starts, Wacker Siltronic AG here today announced is it moving ahead with its previously-stated plans to build a 300-mm silicon wafer factory. The German company will produce the 300-mm wafers at its Freiberg plant in the German state of Saxony, starting in August of 2004. The initial capacity of the plant will be 60,000 wafers per month, which could ultimately increase to 150,000 per month. The investment, totaling EUR 430 million (US$424.84 million), will create more than 600 new jobs, said Peter-Alexander Wacker, president and CEO of Wacker. "When fully expanded, the new large-wafer production facility in Freiberg will almost triple our existing capacities in Burghausen, Germany, and Hikari, Japan,” he said in a statement. “This will make Freiberg the third pillar of our worldwide manufacturing network for the 300-millimeter technology of the future,” he said. “We plan to send a certain portion of the wafer substrates from Freiberg to Taiwan for the epitaxial process, in close proximity to customers there." In 2000, Wacker started a feasibility study for construction of a new 300-mm plant that would dramatically increase shipments of large-diameter silicon substrates to IC makers (see Nov. 22, 2000 story ). Faced with a slowdown in the chip industry, Wacker last year announced it was suspending its fast-track capacity expansion plans for blank wafer substrates used in semiconductor fabrication (see Oct. 26, 2001 story ).