Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (4812)	1/7/2003 5:00:52 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 25522

300-mm 'cross-over' due in 2004, says Sematech CEO By Mark LaPedus Semiconductor Business News (01/07/03 03:47 p.m. EST) PEBBLE BEACH, Calif.--The shift towards 300-mm fabs for mainstream chip production has been sluggish at best. Nearly all IC makers have push out their 300-mm fab projects, due in part to current and severe semiconductor downturn. And the costs to produce chips in 200-mm fabs are arguably less expensive than the new 300-mm plants, according to analysts. But some believe that 300-mm manufacturing is ready to reach critical mass. The cost “cross-over” point from 200- to 300-mm fabs is expected to take place in 2004, said Bob Helms, president and CEO of Sematech International, the Austin, Tex.-based chip-making consortium. “Probably by the end of this year--or in early 2004--you will see the cross-over point for 300-mm,” he said in a presentation at the Industry Strategy Symposium (ISS) here today. Sponsored by the Semiconductor Equipment and Materials International (SEMI) trade group of San Jose, ISS runs from Jan. 5-8 in Pebble Beach.