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To: mred5x5 who wrote (7167)	3/1/2003 11:12:38 PM
From: Krowbar	Read Replies (3) \| Respond to of 8393

Ed, I lifted this release from the Yahoo board. Does it sound like OUM to you? "BAE Systems Information and Electronic Warfare Systems, Manassas, Va., is being awarded a $46,889,797 cost-reimbursement/no-fee contract modification for The Capital Expansion project capitalization funds for radiation-hardened microelectronics production facilities. This acquisition seeks to establish a domestic prototype manufacturing capability to produce 0.25 micron (and ultimately 0.15 micron) radiation hardened electronic devices under the authority of Title III of the Defense Production Act. At this time $13,500,000 of the funds has been obligated. BAE will perform this effort in Manassas, Va. The Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio, is the contracting activity (F33615-02-9-5324, P00001)." This looks like OUM's year. "OUM as a top candidate for embedded memory in uProcessors, ASP's, DSP's, etc. These applications move OUM up from the jelly-bean dedicated memory arena." What are ASP's and DSP's? Del

To: mred5x5 who wrote (7167)	3/2/2003 11:53:23 PM
From: Ray	Read Replies (1) \| Respond to of 8393

>Freely interpreting the graph, I expect that the 2 orders of magnitude (10^5-10^7) resistance range covers the extremes of crystalline-to-amorphous so the structure IMO is possibly a high aspect ratio via (hole) with a small crystalline volume adjacent to the heating electrode and a relative extensive length of amorphous material above that to the upper contact. Perhaps other mechanisms are operative with this structure. Any thoughts RAY?< Not really. But, I think Tyler said the model shown -- earlier called the "matchstick model", I believe -- was illustrative of other structures as well. That is, I assume, the mechanisms could be understood from that model, but the structures being seriously considered for production might be quite different.