To: Gaffer who wrote (2945 ) 3/31/2003 6:55:08 PM From: SemiBull Read Replies (1) | Respond to of 3291 Xilinx, IBM, UMC combination ships 90-nm circuits By Peter Clarke, Semiconductor Business News March 31, 2003 (9:11 a.m. EST) URL: eetimes.com SAN JOSE, Calif. — FPGA maker Xilinx Inc. said today (March 31, 2003) that it has started shipping programmable chips made using 90 nanometer manufacturing process technology, with functional chips having been produced at both its foundry partners IBM Microelectronics and United Microelectronics Corp. The announcements did not say if the chips were engineering samples and did not say where Xilinx had shipped the circuits. Xilinx did say that the move to the new process technology allows die sizes to be reduced by up to 80 percent, compared to competing 130-nm programmable logic solutions. In turn, this should allow a price of $25 for a one-million-gate FPGA in volumes of a quarter of a million devices in 2004. Xilinx did not give a price indication for more moderate volumes of devices. “Together with UMC and IBM, Xilinx has made a significant investment in driving the most advanced 90-nm chip-making processes and 300-mm wafer technology to reduce FPGA costs for our customers, while drastically increasing device densities and functionality," said Wim Roelandts, Xilinx president and chief executive officer, in a statement. Xilinx did not say which particular circuits are being made using 90-nm manufacturing process technology nor whether they were being processed on 200-mm or 300-mm wafers. The company recently announced production qualification for its FPGA lines, based on 130-nm technology and 300-mm substrates at UMC (see March 28 story).