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To: maceng2 who wrote (37360)8/21/2003 3:55:01 PM
From: maceng2  Respond to of 74559
 
what about photo resist

Just considered photo process. Big problems. Much more efficient to use 300mm wafers to coat and develop wafers rather then individual die.

However, epitaxial layers, photo exposure, diffusion, CVD, etching, photo stripping, final assembly, all these processes may have big advantages doing single die at a time.

Modern processes do have a lot of photo layers though..