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Technology Stocks : FSII - The Worst is Over? -- Ignore unavailable to you. Want to Upgrade?

To: SemiBull who wrote (2746)	9/15/2003 7:57:53 PM
From: SemiBull	Read Replies (1) \| Respond to of 2754

FSI International Demonstrates a New ANTARES System CryoKinetic Process to Address a Major Cleaning Challenge: Removal of Defects Without Damaging Sensitive Structures Sunday September 14, 9:00 pm ET MINNEAPOLIS--(BUSINESS WIRE)--Sept. 14, 2003--FSI International, Inc. (Nasdaq:FSII - News) today announced that, in collaboration with a leading integrated circuit manufacturer, it has demonstrated a new CryoKinetic process for removing defects on sensitive device structures. This new process, known as AspectClean(TM), provides customers with a method of removing defects from back-end-of-line (BEOL) patterned low-k structures that will not alter the k value or physically damage the structures. Utilizing the AspectClean process, customers can now apply the ANTARES® system to advanced device technology where traditional methods of defect reduction have been phased out due to damage issues. The new AspectClean soft-cleans using cryogenic aerosols has demonstrated high removal efficiency on sensitive narrow low-k structures without causing damage, which is becoming more critical in 90nm production ramps. An added benefit of CryoKinetic technology is its all-dry process. The use of wet processes with today's hydrophobic advanced materials can lead to watermark residues, but the CryoKinetic process is water free and as a result does not leave watermarks. "The development of this new process further demonstrates the value and extendibility offered by FSI surface conditioning systems," said Don Mitchell, FSI International chairman and CEO. FSI is focused on providing our customers with flexible, cost effective and extendable solutions through 90nm and beyond technology nodes. The ANTARES AspectClean process is a perfect example, as it is a highly productive process that can increase yield, while using less consumables and consequently lowers cost of ownership up to 20 percent. The ANTARES System, a fully automated, single-wafer, CryoKinetic system for 300-mm and 200-mm wafers, has a field-proven history of reducing difficult defects and improving customer yields. FSI's CryoKinetic processing technology is an all-dry, non-reactive process that removes particles through impact by high-velocity cryogenic aerosols, and is ideal for applications on sensitive films and structures, such as copper/low-k and gate modules. FSI International Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the Company's broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company's support services programs provide product and process enhancements to extend the life of installed FSI equipment enabling worldwide customers to realize a higher return on their capital investment. FSI maintains a Web site at fsi-intl.com. Contact: FSI International, Inc., Minneapolis Trade Media: Laurie Walker, 952-448-8066 or Financial Media and Investors: Benno Sand, 952-448-8936 Source: FSI International, Inc.