To: TI2, TechInvestorToo who wrote (7178 ) 9/16/2003 7:13:15 PM From: Proud_Infidel Respond to of 25522 Intel shows 65-nm wafer, tips MPU, software technologies Silicon Strategies 09/16/2003, 1:55 PM ET SAN JOSE -- During the Intel Developer Forum (IDF) here today (Sept. 16, 2003), Intel Corp. demonstrated its first silicon wafer based on 65-nm process technology and disclosed two new and future microprocessors, code-named Tulsa and Tanglewood. Intel also disclosed another technology designed to enable multiple, independent software environments in a single PC--much like the way mainframe class systems operate. Code-named Vanderpool, the technology is aimed at improving system reliability and recovery from computer crashes. Product highlights from Intel in the enterprise computing area include plans to introduce a dual-core version of the company's 32-bit Xeon processor line for servers. The product, code-named Tulsa, is geared for 32-bit multiprocessor systems. Intel is also working on a multi-core version of its 64-bit processor line, dubbed Itanium. The new chip, code-named Tanglewood, will reportedly incorporate 16 processors on the same device. Paul Otellini, president and COO of Intel, made the disclosures during a keynote at IDF, in which the company executive discussed the theme of convergence in computing and communications. Otellini gave more details about the company's security technology--dubbed LaGrande, which should be available in the next two-to-three years. "At a time when the 'virus of the week' seems to plague us all, making our computing devices more secure through the addition of hardware-based security must become a top priority for the industry in order to ensure future growth," said Otellini in a statement. "Intel is committed to bringing technologies to market that end-users want and can use today," he said. "We will offer technologies such as Hyper-Threading for performance, enhanced wireless to enable true mobile computing, LaGrande for security, Vanderpool to improve reliability, flexibility and the overall computing experience, along with our core silicon expertise, which underpins our ability to enable these and other key capabilities," he said.