To: Cary Salsberg who wrote (7627 ) 10/20/2003 11:23:36 AM From: rhering Respond to of 25522 Cary, I agree with you, that the time between peaks will lengthen, as the technology learning curve becomes more complex. The first one to the finish line will however reap enormous financial rewards. Additionally, the increased concentration of chip manufacturing over the last few years should reduce the amount of over-building that occurs during the upcycles. This should help to dampen the peaks & valleys, which is a good thing, particularly for non-traders. On a per unit basis however semi-equipment has never been so cheap. The best example is Intel's margins, maybe 60% for the current quarter. They spent a ton of money over the last few years moving to 300MM and now they are reaping the benefits. It sure looks like the 30% cost reduction in moving to 300MM is real. The economies of scale for chip manufacturing have increased substantially so there are fewer & larger players. However, the technology challenges poised by 300MM & .13 micron have been resolved to the point where the capability is more or less a commodity. To the point where, if you are an out of capacity chip manufacturer, you will loose the sale. The timing of the peak on the (chip sales) ramp will be driven by end demand and not by availability. It looks like chip manufacturers have been playing a very conservative game trying to delay their capacity buys till the last minute. The net effect of this will likely be a very steep capacity ramp in the next 2 to 6 months even if their forecasts are accurate. If they continue to get upside surprises ( .ie Intel did not expect their Q3 results) it will only steepen the ramp. Regards, Roger