To: Kirk © who wrote (860 ) 11/12/2003 11:43:30 AM From: Proud_Infidel Read Replies (1) | Respond to of 43481 ASML to claim 157-nm immersion capability at analysts' meeting By Peter Clarke Silicon Strategies 11/12/2003, 6:32 AM ET VELDHOVEN, The Netherlands -- Dutch chip equipment maker ASML Holding NV said Wednesday (November 12, 2003) that it is able to apply 'immersion' to 157-nanometer wavelength lithography to extend that chip making technology below the 45-nm manufacturing process node. The claim is made in addition to mention of nearer-term plans to extend 193-nm lithography with immersion. The company made its announcement one day before a meeting with investors and financial analysts to be held in Veldhoven intended to discuss, among other things, the results of a fast-track R&D program in immersion (see October 30 story). Although the extension of 193-nm lithography by using water between the wafer and the last lens has become a popular topic of discussion, none of the lithography companies has formally announced product plans, although AMSL may change that on Thursday (November 13). The 193i technology was seen as an alternative to the next-generation of dry lithography at the 157-nm wavelength, a technology to which AMSL was strongly commited, adding to uncertainty in the market. In addition, no consensus has formed around a suitable liquid for use at 157-nm, a wavelength for which water is not suitable. If ASML or any of its research partners have identified a liquid and done any meaningful work in this area it would represent a significant change in the lithography landscape. ASML said that at the meeting it would provide an updated technology roadmap, and review cost-cutting measures in operations. ASML began a cost reduction program in July 2002, which was added to in mid 2003 (see July 16 story). The possibility of extending 193-nm dry lithography by replacing the air between the silicon wafer and the lens with water has been proposed only relatively recently. As a result long-lead time research groups, such as ASML's European research partner IMEC, have yet to begin formal programs to study the possibility. ASML began testing the possibility of immersion on its Twinscan lithography systems early in 2003, and said market researchers estimate the market for these immersion tools to grow to $230 million a year by 2005 from zero today. Since then senior ASML executives have dropped hints about good progress in immersion without making a formal announcement (see October 16 story). Such an announcement might have undermined the company's previous strong commitment to 157-nm dry lithography. ASML is due to announce on Thursday that using Twinscan immersion lithography machine allows metrology and overlay to be done in the dry while lithography is done under liquid and that its research has shown that the existing 193-nm lens system has proved easy to adapt for immersion without a redesign. At the meeting IMEC is scheduled to present a synopsis of its 157-nm lithography research, although this has been mainly based on a Micrascan VII lithography machine. It remains to be seen whether this will include any reference to an immersion extension.