Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: robert b furman who wrote (8251)	12/5/2003 7:16:22 PM
From: Proud_Infidel	Respond to of 25522

IBM set to build new 300-mm fab in U.S., says report Silicon Strategies 12/05/2003, 4:40 PM ET SAN FRANCISCO--IBM Corp.'s Microelectronics Group is reportedly set to build a new 300-mm fab in the United States, according to a new report from American Technology Research Inc. today (December 5, 2003). "IBM is in the process of getting local permits to construct another 300-mm fab in East Fishkill, N.Y. and we can expect numerous more 300-mm fab announcements in the coming quarters," wrote Bill Ong, an analyst for the Old Greenwich, Conn.-based research house, in the report. In the report, Ong indicated that the current IC recovery has created a new wave of capital spending and fab announcements from chip makers in China, Japan, Korea and Taiwan. U.S. chip makers are lagging in terms of capital spending, reportedly with the exception of IBM. "Early reluctance to be 'first-to-spend' is now translating to the more desirable 'second-to-spend' as chipmakers are making plans for new 300-mm fabs, such as IBM's pending permit for a new 300-mm East Fishkill fab," Ong said. At present, IBM has one 300-mm fab in East Fishkill, which is being used for ASIC and foundry work. In 2000, IBM Corp. announced plans to build the world's most advanced chip-making facility here, which will include a 300-mm wafer fab to process ICs with copper interconnects, low-k dielectrics, and silicon-on-insulator (SOI) substrates (see October 10, 2000 story). IBM was reportedly building a new 300-mm fab in East Fishkill for Advanced Micro Devices Inc. But AMD decided to build its own, new 300-mm fab in Dresden, Germany.