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To: Kirk © who wrote (12813)12/28/2003 3:04:59 PM
From: Zeev Hed  Read Replies (1) | Respond to of 95541
 
Unfortunately, the article is mum as far as the "stamping" technique is concerned. As a matter of fact, the article says nothing whatsoever about the nature of the breakthrough the HP team achieved. It surely is not three years out, and not even five years out, quite a shallow article as far as I am concerned. Gee, SKS from WAVX does better... (g).

ATT at the time developed a technology of "printing" circuits on thin sheets of plastics, mostly for disposable devices, it has been more than five years since the press carried that "discovery", has anyone seen those devices? There was another outfit working on "ball" self assembling circuits, but not heard of that recently neither. These join the category of "promsing" technologies like OUM and Si-28 based devices, a lot of hot air, no devices... (g).