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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?


To: Bilow who wrote (87456)12/29/2003 4:22:59 PM
From: Pat Hughes  Read Replies (1) | Respond to of 93625
 
Tsk Tsk Tsk.....

You have never met the 'the professor'.

I wouldn't describe him as "Smug".

Though, I am pleasantly surprised that you once again showed some of your colors. Resentful of those with an ability to make money perhaps?

An inferiority complex?

Does thoust havith a smallith willy?



To: Bilow who wrote (87456)12/31/2003 1:54:41 AM
From: h0db  Read Replies (1) | Respond to of 93625
 
Carl, I think we're about to enter one of your quiet periods.

Hope those MU checks don't bounce.



To: Bilow who wrote (87456)12/31/2003 9:19:38 AM
From: blake_paterson  Respond to of 93625
 
napkin, huh..

Here is just a smattering of information from the Rambus brief showing what the MMs knew:

c. Siemens Responded to the Technical Descriptions
with a List of Questions about Rambus's Inventions.

626. Both Dr. Farmwald and Dr. Horowitz received feedback from Siemens
regarding the November 5, 1990 technical description. (RX 102; RX 117; Farmwald, Tr. 8171-72; Horowitz, Tr. 8541-42).

627. A fax from K. Horninger of Siemens to Dr. Farmwald, dated December 7, 1990, contained a detailed list of questions relating to the November 5, 1990 technical description. (RX 102; Farmwald, Tr. 8171-73).

628. A fax from H.J. Neubauer of Siemens to Dr. Horowitz, dated January 29, 1991, stated “Dear Dr. Horowitz, concerning the RAMBUS Technical Description some basic items remained open. In the following we present a list of detailed questions to you which we would like to get answered.” (RX 117 at 2; Horowitz, Tr. 8542).

629. A number of the questions in the fax that Siemens sent to Dr. Horowitz related to the four features of Rambus technology at issue in this case. Question number one in the Siemens fax asked about the details of how eight bits of data would be transmitted by the DRAM and relates to Rambus's variable block size feature. (RX 117 at 2; Horowitz, Tr. 8543-44).

630. Question number two in the Siemens fax asked about the implementation of variable latency in the Rambus technology. (RX 117 at 2; Horowitz, Tr. 8544).

631. Another question in the Siemens fax referenced Figure 13 on internal page 14 of the November 5, 1990 technical description. (RX 117 at 4). That figure showed dual-edge clocking or double data rate on the output. Dr. Horowitz's understanding was that Siemens' question related to the implementation of the double data rate drivers as
shown in the November 5, 1990 technical description. (RX 94 at 19; RX 117 at 4; Horowitz, Tr. 8546).

632. Another question in the Siemens fax referenced Figure 28 on internal page 41 of the November 5, 1990 technical description. (RX 117 at 4). That figure shows a delay locked loop and Siemens' question was about the delay locked loop. (RX 94 at 46; RX 117 at 4; Horowitz, Tr. 8546).

d. The April 1991 Technical Description Discloses the Rambus Inventions.

633. A still later Rambus technical description was released on April 1, 1991 and was a more complete version with many more technical details. (RX 130; Farmwald, Tr. 8171; Horowitz, Tr. 8538).

634. The April 1, 1991 technical description disclosed dual-edged clocking. The document contains the same figure relating to inputting data on both edges of the clock as in the May 7, 1990 and November 5, 1990 descriptions. (RX 63 at 10; RX 94 at 15; RX 130 at 36; Horowitz, Tr. at 8539).

635. The April 1, 1991 technical description disclosed using a phase locked loop on the DRAM. (RX 130 at 56; Horowitz, Tr. 8539).

636. The April 1, 1991 technical description disclosed programmable latency through the use of a “read delay” or latency register. (RX 130 at 94; Horowitz, Tr. 8539-40).

637. The April 1, 1991 technical description disclosed variable block size or burst length, with the value in a “count” field representing the number of bytes to be transferred. (RX 130 at 64; Horowitz, Tr. at 8539).

3. Rambus Disclosed Its Inventions In A Series Of Public Documents.

a. Rambus Disclosed Its Inventions In A Marketing Brochure.

638. In early 1992, Rambus produced and distributed its first marketing brochure about Rambus technology. (RX 2183; Horowitz, Tr. 8547). The 1992 marketing brochure disclosed the four features of Rambus technology at issue here. (Horowitz, Tr. 8547-48).

639. The 1992 marketing brochure states that the “heart of [the Rambus] Interface is high performance PLL (phase-locked-loop) circuitry which provides the clocks for transmitting and receiving Rambus Channel data.” (RX 2183 at 6).

640. The 1992 marketing brochure also states that there can be “Transfers of 1 to 256 Bytes per Request . . . .” (RX 2183 at 7). This discloses variable burst length, because data transfers could involve a variable amount of data.

641. The 1992 marketing brochure also states that “Data is effectively transferred on both edges of the clock.” (RX 2183 at 9). This discloses dual-edge clocking.

642. The 1992 marketing brochure also states that “the Read Data Packet is returned a time Read Delay after the Request Packet” and that this delay value is “programmed into the configuration registers of all devices during system initialization.” (RX 2183 at 11). This discloses programmable latency.

b. Rambus Disclosed Its Inventions In Publications Describing The First Rambus DRAM

643. The first Rambus DRAM was a 4.5 megabit Rambus DRAM produced by
Toshiba in the 1991-92 time frame. (Horowitz, Tr. 8548-49).

644. A paper about the Toshiba 4.5 megabit Rambus DRAM was presented at the 1992 International Symposium on VLSI Circuits (VLSI Circuits Symposium) and published in the proceedings of that symposium. (RX 301 at 76-77; Horowitz, Tr. 8552-54).

courtesy of JA on TMF



To: Bilow who wrote (87456)12/31/2003 9:25:52 AM
From: blake_paterson  Read Replies (1) | Respond to of 93625
 
controlling the supply, yeah...

From the Rambus brief of 9/9/03. Here is how the conspiracy was born:

4. The DRAM Manufacturers Acknowledged – By
Undertaking Extraordinary Efforts To Slow Or
Block RDRAM's Market Acceptance – That It Is
Intel's Decision making, Not JEDEC Standardization,
That Most Strongly Influences Marketplace Success.

1548. The DRAM manufacturers were well aware of Intel's power to create a defacto industry standard in selecting the RDRAM device. They also recognized that JEDEC standardization of a competing device would mean nothing if Intel did not change its course, and they knew that “Intel will not change course unless Rambus fails.” (RX 870 at 1). Finally, the manufacturers recognized that they could not affect Intel's decision without concerted action; they “need[ed] some united strategy.” (RX 808 at 2). As a result, both before and after Intel announced its selection of RDRAM, Intel faced resistance – organized, concerted resistance -- from the DRAM manufacturers.

1549. There has been substantial disagreement among the parties about the relevance in this case of evidence of concerted action by DRAM manufacturers that was intended to limit or prevent the marketplace success of RDRAM. While such evidence may not be dispositive of any material issue, it is relevant for at least four reasons.

1550. First, as noted above, it tends to show that it is Intel's selection, not JEDEC's standardization, that influences marketplace success for a DRAM device or technology.

1551. Second, it tends to rebut Complaint Counsel's argument that Rambus' motivation in asserting its patents in 1999 and 2000 should be viewed with suspicion because the assertion of those patents came after RDRAM had supposedly failed to compete on the merits because of its (allegedly) inherently high manufacturing costs.

1552. Third, it tends to place in context the testimony of the executives and employees of DRAM manufacturers whose words and deeds are reflected in the evidence in question. Their interest in a finding that RDRAM failed on its merits, rather than as a result of collusive action, is likely to be affected by their participation in such action.

1553. Finally, while Complaint Counsel necessarily have focused their efforts on advancing the allegations made in the Complaint, this Court has a broader responsibility to the Commission and the public. If this Court receives evidence of collusive action by competitors that may have had the effect of reducing consumer choice, raising prices, or
eliminating a superior technology, it is appropriate to bring that evidence to light. See FTC Act, 15 U.S.C. §§ 43, 45.

1554. With these points in mind, the Court has considered the evidence presented and finds reason to believe that the DRAM manufacturers: (1) were alarmed by the possibility that Intel's selection of the RDRAM would lower their profits and cause them to lose control of future DRAM design and implementation; (2) joined together in various
consortia with the intention of impairing or blocking the successful marketplace launch of RDRAM; and (3) agreed to steps that resulted in lower production and higher prices of RDRAM, thus limiting and ultimately preventing RDRAM's success.

1555. In September 1996, for example, Hyundai executive and SyncLink
Consortium chairman Farhad Tabrizi wrote an e-mail entitled “Emergency request for help!” that expressed a concern that “the real motive of Intel is to control DRAM manufacturers . . . .” (RX 778 at 1). According to Mr. Tabrizi, Intel's actions would give it “control of DRAMs and other CPU makers. We will become a foundry for all Intel
activities and if Intel would like and desires to do business with us then we may get a small share of the their total demand.” (RX 778 at 1).

1556. Mr. Tabrizi concluded his September 1996 e-mail by 1556. Mr. Tabrizi concluded his September 1996 e-mail by writing, “I urge you to
please educate others and get their agreement to say 'NO TO RAMBUS AND NO TO INTEL DOMINATION.'” (RX 778 at 1).

1557. Mr. Tabrizi sent this email to one of his competitors, Jim Sogas at Hitachi, for comments. (Tabrizi, Tr. 9035). Prior to trial, he had testified that he was trying to get agreement from other DRAM manufacturers to say “no” to Rambus and “no” to Intel domination. (Tabrizi, Tr. 9038). At trial, however, he claimed that he could not recall sending the e-mail to other DRAM companies. (Tabrizi, Tr. 9037-38). 1558. In December 1996, at a SyncLink Consortium meeting attended by various manufacturers, Mr. Tabrizi stated that “[m]any suppliers are paranoid over the prospect of a single customer, e.g., Intel, having control of market. We can't resist such a possibility
individually. We need some united strategy.” (RX 808 at 2).

1559. At that same meeting, the assembled manufacturers agreed to hold a meeting of DRAM manufacturer executives in Japan in January 1997. (Tabrizi, Tr. 9041). Prior to the January 1997 meeting of executives, Mr. Tabrizi sent an email to other DRAM manufacturers that stated that the “Intel decision to go on a Rambus route was pure political
and domination and control over the DRAM suppliers and not technical.” (RX 802 at 3; Tabrizi, Tr. 9041-42). He then urged a unified effort to prevent Intel from gaining “control”: “As I have mentioned many times before, Intel does not make DRAMs, we do. And if all of us put our resources together, we do not have to go on this undesirable path.
The path of control and domination by Intel.” (RX 802 at 3). He pleaded with the DRAM manufacturers to “stick together on this matter.” (RX 802 at 3; Tabrizi, Tr. 9042-43).

1560. At the January 1997 meeting of DRAM executives, Mr. Tabrizi warned the assembled executives that if Intel succeeded in making RDRAM the next generation memory device, “DRAM manufacturers would loose control of specification and the gross margins will decline.” (RX 849 at 44). Mr. Tabrizi conceded at trial that it was his view at
the time that if Intel's selection of Rambus did not change, the gross margins of DRAM manufacturers would decline. (Tabrizi, Tr. 9048).

1561. Tabrizi's January 1997 presentation also warned that if Rambus became the next generation memory solution, “ALL DRAM COMPANIES WILL BECOME FOUNDRIES for a single source CPU manufacturer.” (RX 849 at 44). The phrase “single source CPU manufacturer” was a reference to Intel. (Tabrizi, Tr. 9046).

1562. Micron engineer Terry Lee participated in the January 1997 DRAM executive meeting; his notes reflect that Siemens executive Dr. von Zitzewitz stated that Tabrizi's “[c]ontrol concerns are realistic.” (CX 2250 at 2; Tabrizi, Tr. 9047-48). The notes also state that Dr. von Zitzewitz was “[d]isappointed with some statements accepting Rambus
II. 0.1% royalty would have been OK. . . . The bottleneck of a small company is bad. Rambus is not acceptable.” (CX 2250 at 2). Mr. Lee's notes were later made available to all members of the SyncLink Consortium (which was renamed the “SLDRAM Consortium” around this time). (Tabrizi, Tr. 9050; RX 855 at 1).

1563. After the January 1997 DRAM executive meeting, Mr. Tabrizi set up an e-mail “reflector” so that the DRAM supplier executives – ostensibly fierce competitors – could communicate among themselves via private e-mail. (Tabrizi, Tr. 9052; RX 938 at 1).

1564. Throughout 1997, 1998 and 1999, Mr. Tabrizi and others kept up regular communications about Rambus with their competitors, often sharing cost, production and planning information ordinarily maintained in confidence by true competitors. (Tabrizi,
Tr. 9053; RX 916 at 1; RX 1181 at 1; RX 1155 at 1; RX 2191 at 1-2; RX 2192 at 2-3; RX 1105 at 1; RX 1386 at 1; RX 1487 at 4).

1565. In February 1998, for example, Jeff Mailloux of Micron wrote an email to Mr. Tabrizi stating that Mr. Mailloux had spoken to a reporter for an industry publication called EE Times. (RX 1105 at 1). Mr. Mailloux stated that “I told him that at any density
and any process that is available in 1999, RDRAM is at least 30 percent cost adder for Micron,” and then encouraged Mr. Tabrizi to call the reporter with Hyundai's views. (RX 1105 at 1). Mr. Mailloux asked Mr. Tabrizi to “please visit me if I end up in jail. . . .”
(Id.).

courtesy of JA on TMF



To: Bilow who wrote (87456)12/31/2003 9:27:40 AM
From: blake_paterson  Respond to of 93625
 
SC Bilow, how do you spell RICO?

From www.ftc.gov/os/adjpro/d9302/030106ramsecondset.pdf

REQUEST FOR ADMISSION NO. 149:
Admit that one of the strategies described by Bert McComas at his April 13, 1998 seminar was to “tape out but do not fully productize or cost reduce DRDRAM.” [Inquest 843].

REQUEST FOR ADMISSION NO. 150:
Admit that after Mr. McComas gave his Rambus strategy seminar on April 13, 1998, he was invited by SLDRAM, Inc. to speak to SLDRAM, Inc. company executives at a meeting i n Monterey, California on or about June 25, 1998. [Tabrizi, p. 175, 178; HR 905_114285].

REQUEST FOR ADMISSION NO. 151:
Admit that executives from Korean and Japanese DRAM manufacturers were
present for Mr. McComas's June 25, 1998 presentation to SLDRAM, Inc. company executives. [Tabrizi, p. 178].

REQUEST FOR ADMISSION NO. 152:
Admit that at the June 25, 1998 presentation, Mr. McComas stated that he wanted to receive DRAM manufacturers' DRDRAM production estimates in order to create and then send to DRAM manufacturers a combined DRDRAM forecast. [Tabrizi, p. 179].

REQUEST FOR ADMISSION NO. 153:
REDACTED.

REQUEST FOR ADMISSION NO. 154:
REDACTED.

REQUEST FOR ADMISSION NO. 155:
Admit that after SLDRAM, Inc. became AMI, AMI attempted to provide the same service to its member companies that is referenced in Request No. 154 above. [Tabrizi, p. 180]

Excerpts from a summary of Tabrizi's testimony - boards.fool.com

The minutes from a 98 meeting to define SLDRAM and Virtual Channel DRAM that was held at Micron was displayed. The meeting was attended by reps from Micron, NEC, Mosaid, Hyundai and Siemens. A note in those minutes read “According to Tabrizi, he has given Rambus ASP projections of next year that are 2 to 3 times today's SDRAM prices. They also gave to Intel a production projection of 3 times their actual plans. They encouraged every manufacturer to do the same in order to not let Intel create an oversupply.”

A display from 99 showed that Tabrizi and others at Hyundai discussed what should be done about Samsung ramping RDRAM. Internally, executives sent Tabrizi a document entitled, “Rambus, Recommendations and Issues.” An email to Tabrizi suggested the they talk to Samsung. “With Samsung building significant amounts of product, we need to work with them to limit the supply in the market, otherwise we both will be competing for market share, which will result in an oversupply. We have to meet with Samsung and discuss our and their production plans. TAM analysis and targeted market share. (WW and strategic account) and reach consensus.”

courtesy of RB on TMF



To: Bilow who wrote (87456)12/31/2003 11:10:10 AM
From: Estephen  Read Replies (1) | Respond to of 93625
 
Bilow going to jail. The dam is breaking down and every detail will of this fraud againest rambus, consumers and the computing industry will be public. It will be interesting when we find out who was paying that bottom of the bucket bilow.