Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (8399)	12/30/2003 7:49:59 AM
From: Proud_Infidel	Read Replies (1) \| Respond to of 25522

Taiwan's Winbond to finalize 300-mm fab project By Silicon Strategies 12/30/2003 12:55 AM EST HSINCHU, Taiwan--Taiwanese chip maker Winbond Electronics Corp. will finalize its plans to build a 300-mm fab next month, according to a report from the Associated Press. Possible partners for the $2.2 billion plant include Germany's Infineon Technologies AG and Japan's Sharp Corp., according to the report, which cited the Economic Daily News. "The plan hasn't really been decided yet. We will finalize it before the Chinese Lunar New Year and will hold a meeting at that time," said Wilson Wen, vice president of Winbond, in the report. In 2004, the Chinese Lunar New Year falls on Jan. 22. Winbond is a supplier of DRAMs and other chip products.