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Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (8848)	2/10/2004 8:56:46 PM
From: Big Bucks	Read Replies (2) \| Respond to of 25522

"In addition, chip company executives say that die sizes will reach 450mm by 2012, up from the current 300mm dies today. No one was willing to elaborate on that." Well this is obviously wrong...300mm is state of the art WAFER size....we will not see 450mm product wafers... It costs to much to design and manufacture the equipment, support equipment and infrastructure. Equipment companies will not spend the exhorbitant R&D expense required, the ROI wouldn't justify the cost. BB