SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Strategies & Market Trends : YEEHAW CANDIDATES -- Ignore unavailable to you. Want to Upgrade?


To: Sergio H who wrote (4599)2/18/2004 9:16:53 AM
From: JoeinIowa  Read Replies (1) | Respond to of 23958
 
More ESIM News.

Press Release Source: e-SIM Ltd.

e-SIM's MMI Solution to Be Integrated in Texas Instruments' Wireless Chipset Platforms
Wednesday February 18, 8:55 am ET

JERUSALEM--(BUSINESS WIRE)--Feb. 18, 2004--e-SIM Ltd. (OTCBB: ESIM.OB - News), a leading provider of Man Machine Interface (MMI) solutions for wireless platforms and device manufacturers, announced today that they have signed an agreement with Texas Instruments Incorporated (TI) for the inclusion of their MMI in TI's wireless Chipset platforms.
The agreement with Texas Instruments, the world's leading wireless chipset manufacturer, calls for e-SIM to provide an MMI reference implementation and a set of development and customization tools for TI's wireless Chipset platform reference designs, based on e-SIM's RapidPLUS(TM) technology. TI plans to offer the feature-rich MMI, together with RapidPLUS(TM) tools, as an integral part of its reference design offering, enabling its customers to bring customized phones to market faster. The pre-integrated MMI reference design and tools will also facilitate quicker development of customized products and development of derivative products.

In commenting on the recent agreement, Yaron Eldad, COO and CFO of e-SIM Ltd. said, "We are very pleased about the collaboration between e-SIM and Texas Instruments. We believe that our highly flexible and comprehensive MMI solution will enable TI to roll out a platform offering that will engender a wide range of appeal. For e-SIM, this agreement contributes to further paving the way for a growing steady revenue stream based on our solution for the mobile industry." e-SIM's MMI Solution integrated on TI's platform will be demonstrated at the forthcoming 3GSM Exhibition in Cannes.

Louc Hamon, WW Product Marketing Manager for TI's 2G/2.5G Wireless Chipset Products said, "Following a thorough examination of the available solutions, we have chosen e-SIM's MMI solutions to be part of our platform. We are excited about the opportunity to offer our customers the significant benefits that will result from the pre-integrated MMI reference design and the accompanying RapidPLUS(TM) development tools, enabling them to bring better products to market in a fast and cost effective manner."



To: Sergio H who wrote (4599)2/18/2004 12:27:56 PM
From: Ditchdigger  Respond to of 23958
 
Thanks for the article Sergio, home for lunch and just took the profits on all my metals---for now..high ho, high ho, back to work I go
..^)DD