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To: StanX Long who wrote (13426)2/19/2004 11:41:13 PM
From: StanX Long  Read Replies (1) | Respond to of 95724
 
China’s He Jian to more than double capacity this year

Katherine Chiu, Hsinchu; Jack Lu, DigiTimes.com [Friday 20 February 2004]

China-based foundry He Jian Technology plans to boost its 8-inch capacity from 18,000 wafers per month to 20,000 wafers by mid-2004 and further to 30,000 wafers by year-end, according to sources.

He Jian has begun installing equipment at its twin fab located in the Suzhou Industrial Park since the beginning of this year. The facility is designed to have capacity to process 60,000 wafers per month.

The Chinese foundry also plans to double its workforce (excluding managers) to 1,000-1,200 by year-end, sources said.

He Jian’s fab has run at high utilization rates since late 2003 due to growing 0.25- to 0.35-micron process orders transferred from its Taiwan-based ally United Microelectronics Corporation (UMC). It has also benefited from the booming demand for display panel controller and driver ICs.

He Jian was found in November 2001 by a group of UMC veterans.