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To: Return to Sender who wrote (14490)	4/15/2004 9:14:23 AM
From: The Ox	Respond to of 95850

Mattson Technology and Tokyo Electron Ltd. Announce a Strategic Technology Alliance Business Wire - April 15, 2004 08:30 TOKYO & FREMONT, Calif., Apr 15, 2004 (BUSINESS WIRE) -- Tokyo Electron Ltd. (TEL), a global supplier of semiconductor and flat panel display production equipment, and Mattson Technology Inc. (Nasdaq:MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced a strategic technology development partnership and the successful integration of Mattson's proven rapid thermal processing (RTP) technology with TEL's advanced gate dielectric technology. The collaboration combines TEL's successful Trias(R) SPA Plasma Processing system with Mattson's single-wafer, RTP, low-pressure annealing (LPA) module. The LPA module, which was designed and developed at Mattson and combined with TEL's technology, will produce state-of-the-art gate dielectrics by combining Mattson's expertise in RTP with TEL's ultra-thin oxide technology and nitridation by SPA (slot plane antenna). Several modules have been placed at key customer sites. The LPA module will be manufactured by Mattson exclusively for TEL and integrated with other process modules on TEL's Trias single-wafer platform. As part of the collaboration, TEL will provide customer support and Mattson will provide technology support for the system. "Our joint development work with TEL is an extension of Mattson Technology's overall strategy to leverage technology alliances to develop best-of-breed products that deliver superior results on the wafer for our customers," said Robert B. MacKnight, chief operating officer of Mattson Technology. "We expect Mattson's and TEL's combined expertise in transistor development to enhance our abilities to offer advanced transistor formation technologies to the industry and look forward to working with TEL on future collaboration projects." "Our strategic partnership with Mattson Technology not only provides our SPA tool with a competitive advantage, but also demonstrates the creativity of both companies when trying to find solutions to our customers' unique problems," said Clark Takenaka, general manager of TEL's Single-Wafer Deposition Business Unit. The next phase of the joint development partnership is expected to yield improved processes for high-k dielectrics, ultra-thin interface layers and plasma oxy-nitride films for gate and capacitor applications serving both logic and memory markets.