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To: Proud_Infidel who wrote (10067)6/2/2004 8:11:25 AM
From: Proud_Infidel  Respond to of 25522
 
SMIC receives 300-mm wafer equipment for Fab 4
By Peter Clarke
Silicon Strategies
06/02/2004, 7:29 AM ET

BEIJING, China -- Shanghai-based foundry Semiconductor Manufacturing International Corporation received its first chip manufacturing equipment for use with 300-mm diameter wafers Wednesday (June 2) the company said.

SMIC did not say what type of equipment this was or who the manufacturer is, but said the equipment is due to be installed in SMIC's Fab 4 in Beijing, China.

Fab 4 is due to be China's first 300-mm wafer fab when it commences production in the second half of 2004, SMIC said. "SMIC is pleased to be ramping up its 12-inch fab to serve the needs of leading semiconductor players such as Infineon and Elpida. The equipment move-in at Fab 4 demonstrates SMIC's ability to compete in the global semiconductor market by providing our customers with the most advanced foundry services currently offered in the world," said Marco Mora, chief operating officer of SMIC, in a statement.

"We will continue to build up a strong base of customers for Fab 4 and diversify our offerings to include advanced logic production, as successfully demonstrated in our fabs in Shanghai," said Mora. Fab 4's planned capacity is 20,000 wafers per month by the end of 2005, or 45,000 wafers per month when measured in 200-mm diameter wafer equivalents.