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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Elmer Phud who wrote (178407)	6/27/2004 3:19:04 PM
From: Ali Chen	Read Replies (1) \| Respond to of 186894

"In simple terms this is a failure to properly etch away the passivation layer on the die pads. It can easily be fixed at fab and screened at test. It's embarrassing for Intel but quite a minor event." In simple terms, I would strongly recommend for you to restrain yourself from making stupid remarks with such assurance. If you don't etch away the passivation layer on pads, the pads would not bond to chip carrier, and the device will fail immediately on any good tester. Since all chips are tested, and you should know this, the problem is much more subtle, and the "explanation" of poor etch can be anything in any of the numerous etching steps. - Ali