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To: rkral who wrote (178699)7/16/2004 3:10:15 PM
From: robert b furman  Respond to of 186894
 
HI Ron,

I've seen the number of 200-250 yield increase when you shrink dies AND change from 200mm to 300mm.

Ther's a lot of talk about that and I think Intel is finding the new equipment is really redefining how high a yield can be tweaked.

It might well be a pleasnt surprise.

Bob



To: rkral who wrote (178699)7/16/2004 3:20:47 PM
From: The Duke of URLĀ©  Read Replies (1) | Respond to of 186894
 
"Assuming you are referring to the same process on 300mm instead of 200mm, the theoretical increase would be 125%."

I had heard that also, but is Pi is still equal to 3.14159 less kerf. :))



To: rkral who wrote (178699)7/16/2004 3:25:27 PM
From: Elmer Phud  Respond to of 186894
 
What do you think the increase would be for this process change .. without a simultaneous change in wafer size?

Why not do some calculations for yourself?

NorthWood die size = ~135mm2
Prescott die size = ~108mm2 (with larger cache)

icknowledge.com