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To: TGPTNDR who wrote (133644)9/23/2004 8:37:28 PM
From: dougSF30Read Replies (1) | Respond to of 275872
 
Actually, since then, Paul@iHub made his brilliant observation, and I think we can't assume there is any problem.

In fact, I think the evidence suggests 90nm is disspating less power than 130nm, at least at the 3500+ bin.

It's not quite clear where they placed the temperature sensor, but the range of temps under load suggests "die-like" temperatures, not "avg. heatsink" temperatures.

The photo lends some support to this notion-- the sensor cable is the one with two black wires.

The point is that one would expect the die temperature of an 84mm^2 part dissipating the same power as a 144mm^2 part to be considerably higher.

Therefore, the fact that the 90nm "die-like" temperature is only up a little bit, *and* that is with the 90nm part being overvolted by 5%, suggests that the 90nm part is dissipating LESS power than the 130nm Newcastle.

Doug



To: TGPTNDR who wrote (133644)9/23/2004 10:47:05 PM
From: Joe NYCRespond to of 275872
 
TGP,

So, at this point I think we can assume the problem is excessive leakage in the cache?

I am not quite sure what we can assume mainly because of the overvoltage problem. Second isue (the one Paul Flynn mentioned) is that when dissipating the same amount of heat from smaller die will cause higher die temperature, I just have no idea how much higher. The heat conductivity from die to heat spreader should be good, but I have no idea about what actual numbers are.

Theoretically, you may have the same overall heat dissipation in 2 dies, but the smaller one will run a little hotter, if everything else remains the same.

Joe