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To: Pravin Kamdar who wrote (133669)9/23/2004 11:12:08 PM
From: combjellyRead Replies (1) | Respond to of 275872
 
"I would expect that this combination would keep the 90 nm die almost as cool as the 130nm die."

I agree with you. Perhaps heatsinker2 should weigh in on this issue...



To: Pravin Kamdar who wrote (133669)9/23/2004 11:17:24 PM
From: dougSF30Respond to of 275872
 
Pravin, not quite. Only with an infinite "perfect conductor" heatsink would both dies be at ambient. Because this is far from the real case, a considerably smaller die with the same power dissipation will have a significantly higher die temperature.

If it doesn't, then the difference in temperature between the die and the heatsink will be basically the same as the larger die.

And that means you can't dissipate the same power, since:

Power = k * Area * Temp-difference / junction_length

And all terms besides Area are the same.

Doug

Doug



To: Pravin Kamdar who wrote (133669)9/23/2004 11:29:00 PM
From: Joe NYCRead Replies (1) | Respond to of 275872
 
Pravin,

The problem area (pun intended) is the die -> heat spreader contact (in case of desktop) or the equivalent contact are on IHS-less chip in notebook chips.

Joe


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