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To: Pravin Kamdar who wrote (133682)9/23/2004 11:49:13 PM
From: dougSF30Read Replies (1) | Respond to of 275872
 
Pravin, now you've got it. Except that the heat spreader doesn't really help the die temperature. (It's just another heatsink, really) But you see why a lower ambient can be required due to increased power density, with no increase in power dissipation.

In the tests they ran, ambient was the same.

So if they are measuring temps close enough to the die, they should see an increase, even if Winchester dissipates the same or a little less power.

Doug



To: Pravin Kamdar who wrote (133682)9/23/2004 11:59:41 PM
From: combjellyRespond to of 275872
 
"My guess is that a good heat spreader between die and heatsink, and a slightly lower ambient requirement (better air flow) would give a die temp not much higher than the 130 nm part."

I am not convinced a heat spreader would be better than having a copper heatsink. Copper has a very low thermal resistanc, the size of the die in question shouldn't make that big of a difference. But this isn't my area, so I am not doing this from any reasonable base of knowledge.


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