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To: niek who wrote (975)	1/3/2005 5:39:14 PM
From: Proud_Infidel	Respond to of 43410

TI to deploy immersion litho, evaluates ASML, Nikon By Mark LaPedus Silicon Strategies 01/03/2005, 5:11 PM ET SAN JOSE, Calif. — Texas Instruments Inc. disclosed it plans to deploy immersion lithography in the future and is evaluating competitive scanners from ASML Holding NV and Nikon Corp. TI is looking to deploy immersion lithography at the 45-nm node, said Hans Stork, senior vice president, chief technology officer and director of silicon technology development at the Dallas-based chip maker. Stork disclosed that TI plans to use immersion in a Q&A conducted by Silicon Strategies. To read the Q&A, click here. Like a growing number of chip makers, TI is looking to deploy "dry" 193-nm scanners at the 90- and 65-nm nodes, followed by "wet" or immersion 193-nm tools at 45-nm. The 45-nm node is slated for the 2007 time frame, with immersion holding the key for chip makers. "It's not a done deal until it's done, but we're counting on that tool being there on a timely manner," Stork said. "Otherwise, we have bigger problems." TI is counting on immersion for good reason. "For us, the real argument is density," he said. "Our goal is to move to a 2X aerial improvement on the device. We need a numerical aperture that is 1 or bigger. 1.05 or 1.1 or something. You can only get a numerical aperture that big with immersion." At present, TI uses two scanner suppliers within its fabs --ASML of the Netherlands and Nikon of Japan. Asked which company will win the immersion lithography tool order, Stork said that TI has not made a decision -- yet.