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To: Nancy who wrote (5394)1/27/2005 9:24:43 PM
From: Gottfried  Read Replies (2) | Respond to of 5482
 
Nancy, here goes:

front end is fabrication of a wafer which is later sliced into chips

back end is where wires and packaging are applied to chips and they are tested before they can be used [soldered to circuit boards.]

Intel explains it much better intel.com