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To: Reseller Mike who wrote (157033)4/20/2005 9:38:05 AM
From: kpfRespond to of 275872
 
Mike

Any. No change in wafer fabbing for Smithfield. Just different cut and packaging.

K.

p.s: HR 3MB Smithfield die photo is your email-inbox.



To: Reseller Mike who wrote (157033)4/20/2005 10:51:09 AM
From: Elmer PhudRead Replies (1) | Respond to of 275872
 
Mike -

I would think it would have to be any adjacent die on a row, so it's only on one axis. Otherwise it would require more than one buildkit. Only 2 though, how do you get 4?


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