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Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: etchmeister who wrote (16371)	10/24/2005 8:25:31 AM
From: Proud_Infidel	Read Replies (2) \| Respond to of 25522

Winbond secures NT$15 billion syndicated loan to fund 12-inch wafer production Press release; Esther Lam, DigiTimes.com [Monday 24 October 2005] To meet the mid- and long- term capital demands for its 12-inch fab expansion plan, Winbond Electronics today announced that it has signed a NT$15 billion five-year syndicated loan agreement. The capital acquired from this syndicated loan will be used to finance the memory specialist’s expansion plan for its 12-inch fab at Central Taiwan Science Park (CTSP). Current monthly production capacity at its 12-inch fab is 8,000 wafers and the amount should further ramp to 16,000 by the end of 2006, Winbond noted. By 2007, Winbond expects the output will reach 24,000 wafers per month. In total, Winbond has secured NT$95 billion for its 12-inch fab expansion plan. The company secured a NT$80 billion loan early this year.