To: Gottfried who wrote (17245 ) 1/18/2006 8:07:34 AM From: Proud_Infidel Respond to of 25522 Tool B:B, capacity falls amid slowdown Mark LaPedus EE Times (01/17/2006 10:10 PM EST) SAN JOSE, Calif. — Amid a slowdown in fab utilization, the worldwide chip-equipment book-to-bill ratio hit 1.01 in December, down from 1:08 in November, according to VLSI Research Inc. on Tuesday (Jan. 18). Worldwide front-end fab utilization fell from 96.1 percent in November to 90.6 percent in December, according to the market research firm. It was higher at the back-end, where the average utilization rates for test and assembly hit 95 percent in December. Worldwide equipment bookings amounted to $4.9 billion, while billings reached $4.8 billion in December. “Considering that December is typically a slow month for equipment buying, the recent data reflect an improving bookings environment for the industry,” according to VLSI Research (Santa Clara, Calif.) There is some good and bad news. “The scramble for capacity has resulted in a flurry of order activity, which is expected to continue through the first quarter of 2006,” according to the firm. In January, the book-to-bill ratio is expected to climb to 1:06. Front-end fab utilization is projected to fall to 84.9 percent this month. Following a flat 2005, VLSI Research recently predicted a positive outlook for the semiconductor industry in 2006. Semiconductor revenues are expected to increase by 8.2 percent in 2006, while equipment for ICs and flat-panel displays should grow 6 percent over 2005, according to the research firm. But in many respects, the semiconductor-production equipment industry has become a house of cards. The business won’t see a full-fledged collapse, but the ongoing consolidation among vendors is projected to accelerate this year and next.