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To: etchmeister who wrote (183938)4/2/2006 1:49:53 AM
From: etchmeister  Respond to of 186894
 
just to put CHRT into perspective to its peers; again CHRT revenue contribution from 90nm went up to 19% in 2005 compared to 0% in 2004
Xilinx inks 65-nm foundry agreements with UMC, Toshiba

Dylan McGrath
EE Times
(12/05/2005 7:01 PM EST)

SAN FRANCISCO — Programmable logic supplier Xilinx Inc. Monday (Dec. 5) announced the extension of foundry relationships with Toshiba Corp. and United Microelectronics Corp. (UMC) to include 65-nanometer technology.

Work with Toshiba (Tokyo) has already resulted in successful production of 65-nm field-programmable gate array (FPGA) prototype wafers, including actual programmable logic circuitries, according to Xilinx (San Jose, Calif.). Xilinx signed on with Toshiba for 90-nm production services last October, and Xilinx flagship 9-nm Virtex-4 platform FPGAs are produced in volume at Toshiba’s 300-mm fab in Kyushu, Japan.

"We’re forging ahead at 65nm with confidence, bolstered by the fact that Toshiba is an industry leader in 65nm technologies for digital consumer markets, and in research and development at 45nm and below," said Wim Roelandts, Xilinx chairman, president and CEO, in a statement.

UMC (Hsinchu, Taiwan) has been Xilinx' primary foundry partner for more than 10 years. The companies said Monday that they are in the early stages of process definition for future development of 45-nm FPGAs. Xilinx said it would also consider continuing to collaborate with Toshiba at 45-nm.

According to Xilinx, early investment in 90-nm technology development by both Xilinx and UMC led to delivery of the world’s first 90-nm FPGA product line in 2003.

“Together, UMC and Xilinx have been pioneers across multiple process generations — and we look forward to extending that leadership to 65nm and beyond,” Roelandts said.

“Our mutual success at 90-nm is the latest chapter in a long history of cooperation," said Jackson Hu, CEO of UMC.



To: etchmeister who wrote (183938)4/2/2006 10:16:25 AM
From: Sarmad Y. Hermiz  Read Replies (1) | Respond to of 186894
 
etchmeister,

Your post prompted me to see what-ever happend to AMD's previous JV's.

The UMC JV was not the first AMD JV that did not pan out. It was preceded by a disappointing JV with motorola.

This link was written about exit from motorola JV, and entry into UMC JV.
my-esm.com
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AMD/Motorola R&D deal will be phased out
(02/01/2002 12:49 PM EST)

"Motorola and AMD jointly came to the conclusion that the 65-nm effort needs to be very closely tied to the manufacturing effort," explained Ruiz, during a teleconference with analysts and the press on Thursday. "This technology is going to be challenging from many points of view. The intricacy and the linking that must exist in development and manufacturing is more crucial than ever."

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"Our joint venture with UMC will enable AMD to make the transition to 300-mm manufacturing at precisely the right time," Ruiz told analysts and the press. "We will gain immediate access to an existing 300-mm wafer fab for research and development activities [at UMC] and in the next few years we expect require substantial additional production capacity.

"We believe the optimal time for us to make the transition to high-volume production on 300-mm wafers is in the mid-2005 timeframe when we expect to begin starting production on the 65-nm node," he added.
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"In order to get the cost benefits of going to 300-mm wafers you need to utilize the factory," said W.J. (Jerry) Sanders, chairman and CEO of AMD.
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