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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: j3pflynn who wrote (199273)5/29/2006 11:52:38 AM
From: combjellyRead Replies (1) | Respond to of 275872
 
"but I imagine they're referring to creating the bumps by which the die is connected to the packaging, and test would be a test of individual dies?"

That is precisely the case on both. Final test and sort isn't done until after packaging. That test is mainly to figure out what speed bin the processor is slated for.



To: j3pflynn who wrote (199273)5/29/2006 7:02:21 PM
From: grimesRead Replies (1) | Respond to of 275872
 
j3pflynn/cj re "creating the bumps by which the die is connected to the packaging". This happens after the wafers are cut into individual die? Die that are successfully tested are then sent (to Malaysia) for packaging, final test, and speed grading?

Thanks.


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