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To: combjelly who wrote (199318)5/29/2006 10:09:32 PM
From: misenRead Replies (1) | Respond to of 275872
 
Bump refers to the formation of solder bumps on the die that the package eventually is connected to. The IBM C4 process is a fairly typical example. It is done on wafer-level, generally before wafer sort (testing of the die at the wafer-level). After sort, wafers would be sent to the assy site for assy and final test.

Here's a reference on flip-chip technologies:

flipchips.com

misen



To: combjelly who wrote (199318)5/30/2006 5:41:36 AM
From: TGPTNDRRead Replies (1) | Respond to of 275872
 
CJ, Re:Upon reflection, it probably would be easier to bump the die before dicing.>

Looks to me like it's all wafer level now.

nexxsystems.com

These guys proposed doing it at wafer level back in 2001.

swtest.org

amkor.com

It looks to me like folks are also doing full speed testing at the wafer level now.

-tgp


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