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To: combjelly who wrote (202244)	6/14/2006 8:17:15 PM
From: Sarmad Y. Hermiz	Read Replies (1) \| Respond to of 275872

>> Now a 230 mm^2 die means about 250 die candidates per wafer. 183 mm^2 dies means about 330 die candidates. So that is the equivalent of increasing production by about 30%. This entire calculation was known at time of design. And on day of launch. Did the equations change in 3 weeks ?

To: combjelly who wrote (202244)	6/14/2006 10:24:03 PM
From: Dan3	Read Replies (1) \| Respond to of 275872

Re: Now a 230 mm^2 die means about 250 die candidates per wafer. 183 mm^2 dies means about 330 die candidates. So that is the equivalent of increasing production by about 30%. The impact can be greater than that. There are (for example) 80 defects scattered across the wafer. At 230mm2 you're left with 170 good die but with 183mm2 you're left with 250 - 47% more die.