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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Rink who wrote (202294)	6/15/2006 5:26:18 AM
From: aleph0	Respond to of 275872

Does the Chartered 65nm. transition in mid 2007 ( from slide 7 of 28 - AMD Analyst Day PDF : "Plan to transition to 65nm in mid- 2007" ) actually mean first production wafers ? ...or does it mean they are just starting with the transition ? // Increased Chartered Capacity and 65nm Conversion 90nm production underway at Chartered six weeks ahead of schedule Work with IBM and implementation of selected advanced process control capabilities at Fab 7 delivering excellent results Plan to transition to 65nm in mid- 2007 Foundry volumes a function of demand and pricing //

To: Rink who wrote (202294)	6/15/2006 5:40:01 AM
From: BUGGI-WO	Respond to of 275872

[edited] @Rink - Capacity " Like all other DC NGA products their die size is large at 65nm so Intel won't be able to go to all say 33%?? DC/SC until 45nm because of capacity constraints (33% is a wild guess; to invoke a more reasonable number from someone else here I hope). " Nearly the same lines I wrote today on our german board. Eracer showed the "small" Intel DC DIE sizes, but forgot, that AMD will transition to 65nm. Its clear why he forgot this ... I'm not saying, that the 150mm^2 NGA is big, but when we look at the DIE-sizes which Intel normally is doing in HEAVY HEAVY volume, the tended to be at 100-130mm^2. A few times, less, down to mid 80, a few times more, just a bit over 140mm^2 and a few times at 200mm^2 which was always low-volume. So in the end, they will not shift to smaller versions before 45nm, which is a while away and 150mm^2 is at the very upper end, which they have done on massive volume. Keep in mind, that they also increased layers on 65nm. So they are only 1 under one. AMD = 9, Intel = 8, when I remember correctly. I'm not sure about Intels capacity, because they are doing very different pieces and they ramp and convert all the time, but when I look at this picture from their analyst day: pc.watch.impress.co.jp I'm seeing steady growth in wafer starts but not in the CPU region. Just take a look to the chipset side. It sucks a huge amount of wafers. Keep also in the mind, that they switch to 965 massivly which has a HUGE Die just under 90nm. I don't know this for sure, but the DIE-size for this chipset is imho by far the biggest one in the past years. In the end, they NEED the "new" capacity (old 200mm lines and 300mm too) just to supply all the needed chipsets and on the CPU side? Whats left? edit: " That leads to the question when AMD's mix of DC/SC will be on par with Intel's mix. I'm wondering if Q2 '07 would be a right guess. " Lol, just these lines I wrote too, without seeing your post. ggg BUGGI

To: Rink who wrote (202294)	6/15/2006 7:00:16 AM
From: Rink	Read Replies (1) \| Respond to of 275872

re: For example, take the 4x4 announcement. You and I know that right now, there is no advantage to more than two cores for gaming, so what is going on? Take a look at the pictures: xbitlabs.com There is something missing. There is no HT link from the second CPU socket to the chipset. Why? My guess is that the 4x4 announcement and motherboards are really part of the Torrenza program. Certainly if I bought a 4x4 motherboard, I'd be looking for an FPGA or co-processor to stick in that second socket. Combine that with: Raza Microelectronics will help AMD develop Torrenza: Message 22538891 (Raza Micro being the company that just took over AMD's Alchemy line. AMD now has a stake in Raza Micro). Now the question is what Raza Micro has that AMD needs for 4x4. Here's two of their product lines: 1. XLR processor (based on MIPS64): razamicroelectronics.com 2. Orion processor: razamicroelectronics.com (a highly integrated Ethernet over next-generation SONET/SDH access processor solution) I'm not sure why either of these two lines would fit with Torrenza yet. Regards, Rink