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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Petz who wrote (207938)	8/8/2006 2:51:21 PM
From: Elmer Phud	Read Replies (1) \| Respond to of 275872

if you could explain why defect density should be lower on 300mm wafers. Assuming the fab is running well and the process is healthy, particles are the first order effect determining yield/defect density. They come mainly from equipment, so the same number of particles fall on a 300mm wafer as do on a 200mm wafer, thus the defects per cm2 tends to be lower on 300mm. Additionally, the larger the wafer, the fewer edge die relative to total die, so fewer partial die wasted relatively speaking. Another factor is die size which also makes the ratio of whole die to partial die greater. So shrinking to a smaller die and moving to 300mm has multiple benefits all due to available area.