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To: j3pflynn who wrote (207953)8/8/2006 3:37:38 PM
From: Elmer PhudRead Replies (1) | Respond to of 275872
 
Why would the same amount of particles fall on a wafer with 2.25* the area?

That was my question when I was told it. The answer was that they come from the machine. X number of particles available, 2.25X the die area.



To: j3pflynn who wrote (207953)8/8/2006 4:00:44 PM
From: TGPTNDRRespond to of 275872
 
Paul, Re: ephud - Why would the same amount of particles fall on a wafer with 2.25* the area?>

The same amount doesn't, but lesser numbers per die candidate do.

Some due to clean room, some due to machines, different edge loss parameters, much due to CMP wash.

Sort of think of it in terms of power washing your deck. The crap goes off the deck onto the house then off the house onto the deck.

The bigger the deck the less crap per unit area.

Unless you're building PIVs in which it's all crap.

-tgp