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To: etchmeister who wrote (20618)9/12/2006 7:50:24 AM
From: Proud_Infidel  Respond to of 25522
 
China's fab-tool spending flat, says SEMI

Mark LaPedus
EE Times
(09/12/2006 5:11 AM EDT)

SAN JOSE, Calif. — Semiconductor equipment capital expenditure in China are expected to jump in 2006, but tool spending is projected to be relatively flat in 2007, according to the Semiconductor Equipment and Materials International (SEMI) trade group.

Total fab equipment spending in China is expected to grow from $1 billion in 2005, to $2.03 billion in 2006, to $2.05 billion in 2007, to $2.56 billion in 2008, according to SEMI, based here.

Overall, Chinese semiconductor fab capital expenditures from 2006 through 2008 are expected to exceed $9.8 billion, which is larger than the total capital expenditure of $8.7 billion in last five years from 2001 to 2005, according to SEMI.

Investments in 300-mm fabs and advanced process technology are becoming major drivers for capital spending in the China market, according to SEMI.

"Investment trends are evolving in China, with the future more promising for new fab projects by established semiconductor manufacturers compared to new entrants," said Mark Ding, president of SEMI China, in a statement. "Fab projects that bring advanced technology and significant foreign-investment will find financing and government support more readily available."