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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: ChrisBBo who wrote (210994)	9/18/2006 3:02:03 AM
From: DDB_WO	Read Replies (1) \| Respond to of 275872

65nm die - prototype or not Yes, and like others, I don't think the 65nm die looks like a final production ready layout. It's probably a prototype for functional testing. In that mentioned die estimation thread I also asked Hans de Vries about blue prototype core vs. K8L core changes, because once he made a floorplan based on the photo and the published die plot: chip-architect.com His answer (I'm sure, it's him and he just forgot to login or so): Not really. Aside from the improved FPU, the re-arranged L1d ECC tiles, the re-arranged L1i parity tiles, and a minor change in the lowest left corner of the core, the blue 65nm prototype and K8L seemed identical w.r.t. to the core. Which isn't surprising, once you consider the family lineage between Rev G and Rev GH. So if the K8L die plot isn't another protoype (and you have to agree with me, that it's really hard to find any die plot or die photo from AMD, which represented a core, which didn't make it into a final product ever, back to Am386 days except for some wafer photos with test structures) aceshardware.com We also discussed automated routing (possible thanks to additional metal layers) mentioned by Jerry Moench (video still available here: eecs.umich.edu and slides here: eecs.umich.edu - but these don't contain Moench's oral remarks) Another reason for the spacing apart could be the scaling of the smaller metal layers and a third reason might be the avoidance of hot spots. Just remember electromigration, which will become more important while the manufacturers go to smaller structures.