Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: Cary Salsberg who wrote (20905)	10/18/2006 11:21:29 AM
From: robert b furman	Respond to of 25522

Hi Cary, Agreed on planned lower power consumption during normal use. Need for cooling is during test cycle,which is high power by definition. The stronger/faster the test the lower the cost of test.Thus high power test is fast,less expensive and requires cooling. Smaller line widths require cooling - smaller line widths big part of Moore's law. Higher performance rating draw higher ASP and justifies cooling equipment during test. I do believe the future includes more types of chip being brought into cooling requirements. At first it was just MPU in computers,now all game boxes get it (Ibm last big customer win). Now graphics chips (highend at first) get cooling. The trend is clear and certanily not universal - skewed to high performance only. My bet is more high performance chips in the future. As always appreciate your persective. Bob

To: Cary Salsberg who wrote (20905)	10/26/2006 2:43:29 PM
From: FJB	Respond to of 25522

RE:The move in all chips is toward low power consumption which means low heat generation. hpcwire.com The cooling bottleneck results from the demand for ever more powerful computer chips and becomes one of the most severe constraints of overall chip performance. Today's high performance chips already generate a power density of 100 Watts per square centimeter -- one order of magnitude more than that of a typical hotplate. Tomorrow's chips may attain even higher power densities, which would create surface temperatures close to that of the sun when not cooled (approx. 6000 degrees Celsius). Current cooling technologies, mainly based on forced air convection (fans) blowing across heat sinks with densely spaced fins, have essentially reached their limits with the current generation of electronic products. To make matters worse, energy needed to cool computer systems is rapidly approaching the power used for calculations, thus almost doubling the overall power budget.