To: eracer who wrote (215013 ) 10/27/2006 5:40:17 AM From: Joe NYC Read Replies (2) | Respond to of 275872 eracer,I do too. That is why I believe the first generation of integrated GPU may be of little value for AMD investors. I don't know what the breakdown is between integrated (in the northbridge) and discrete graphics today. Let's say it is 70% integrated and 30% discrete. Having better solution to 70% of the market (including very important mobile market) must be worth something. One thing worth mentioning is that currently, with ODMC, AMD has advantage in some markets (High End server, desktop) but has no advantage - or may have a slight disadvantage in low end market with integrated chipsets. The reason is that Intel integrated solution has memory controller and graphics processor on the same die, with memory accesses not having to go over northbridge - CPU connection. In current AMD (northbridge) integrated solution, the video requests need to go one hop to the CPU, or have some local memory. So while this issue will be solved for AMD with integrated CPU-GPU, it will become an issue for Intel, which is moving to integrated ODMC in similar timeframe, but unlikely integrated CPU-GPU at the same timeframe. I think the integration of ODMC and GPU to the CPU die is a natural progression, but it was a 2 step process due to transistor budgets. Full efficiencies of are achieved only when both steps are completed.AMD will need to transition to XDR or similar high-bandwidth solution if they want a fast integrated GPU to use system memory. A high-end GPU of today like the 7900GT would probably use 30W or less (minus the memory power requirements) and use 60 mm^2 die area if manufactured on 45-nm SOI. The ATI equivalent would be somewhat larger and warmer, but still doable. Unfortunately high-end today will probably be low-end mainstream by late 2008 or early 2009. XBox has shown the solution to high end graphics at 2005 level in 2005. See the system diagram here:en.wikipedia.org It involved total bandwidth to memory of 22.4 GB/s with additional massive bandwidth provided by embedded memory. Looking at K8L die, 2 MB of SRAM L3 seems roughly 30 mm^2. 10MB at 45nm would be roughly 75 mm^2 using SRAM. That would be a bit on the high side even for a high end system, but a cakewalk with Z-RAM. If Z-RAM is 4 to 5 x as dense as SRAM, we are talking 15 to 20mm^2 per 10MB, which could make 20 to 40 MB feasible for high end solution. BTW, don't forget the gaming market. I am pretty sure that combined ATI-AMD are going to be actively working to retain and expand the share of this market. It seems to me that the that after tackling the mainstream market in 2008-2009 with integrated CPU-GPU, the goal will be to tackle the high end market with a solution that at the same time could be the basis of the next-gen game consoles. Joe