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Technology Stocks : Spansion Inc. -- Ignore unavailable to you. Want to Upgrade?

To: Joe NYC who wrote (673)	11/2/2006 12:09:21 AM
From: Joe NYC	Read Replies (1) \| Respond to of 4590

Interesting tidbit from Saifun presentation. On data density, the near term, announced products are from: - Toshiba, 8Gb chip, with data density of 83Mb/mm^2. That translates to 96 mm^2 die - Samsung, 16Gb chip with data density of 92Mb/mm^2, which translates to die size of 173 mm^2 - Seifun projects, if my readin is of their chart is ok, about 100Mb / mm^2 at 60nm process, 200 at 50 nm, 400 at 40nm process Seifun claims: - 16 Gb with Quad at 60nm - 32 Gb with Double Density Quad at 55mm (overtaking NAND, doubling the NAND 16 Gb size) - 64 Gb with same as above at 45nm From the Samsung info above, it seems Seifun is talking about roughly 170 mm^2 die size. Anyway, the implication seems to be that Quad has density parity (or slightly ahead) vs. MLC floating gate NAND, the double density, Seifun't approach should be roughly 2x dense. BTW, Spansion has not (publicly) signed up for this Double Density technology. I wonder If Spansion will do that... Joe